izmomicro, the semiconductor packaging division of izmo Limited, has signed a Memorandum of Understanding (MoU) with Switzerland-based CCRAFT SA and Spain’s Alcyon Photonics SL to collaborate on the design, manufacturing, and commercialization of advanced photonic integrated circuit (PIC) solutions.
The partnership brings together three specialised companies operating at different stages of the photonics technology value chain. The collaboration is aimed at developing next-generation silicon photonics solutions for industries including data communications, telecommunications, aerospace systems, and advanced sensing technologies.
CCRAFT SA, a Swiss photonics foundry originating from the Swiss Centre for Electronics and Microtechnology (CSEM), operates an ISO-certified 150 mm wafer fabrication facility that produces thin-film lithium niobate (TFLN) photonic chips. These chips are used in high-performance electro-optic modulators capable of supporting data transmission speeds exceeding 400 gigabits per second.
Madrid-based Alcyon Photonics SL contributes integrated photonics intellectual property and design expertise to the partnership. The company develops fabrication-ready photonic architectures and design libraries that help accelerate the transition from research prototypes to large-scale production.
izmomicro will provide the advanced semiconductor packaging capabilities required to transform photonic chips into fully operational systems. The company recently demonstrated end-to-end silicon photonics packaging capability, becoming the first company in India to deliver a complete packaging workflow covering design, simulation, optical alignment, fibre attachment, hermetic sealing, and system-level testing.
Operating from a Class 1000 cleanroom facility in Bengaluru, izmomicro’s infrastructure includes 3D die stacking, flip-chip assembly, fine-pitch wire bonding, and co-packaged optics integration. These capabilities play a crucial role in converting photonic chip designs into deployable commercial products.
The collaboration aims to create an integrated development pathway that links photonic chip design, fabrication, and packaging into a unified production pipeline. By combining European expertise in photonics research and fabrication with India’s emerging semiconductor packaging capabilities, the partnership seeks to strengthen global supply chain resilience in advanced photonics.
Commenting on the agreement, Dinanath Soni, Director of izmomicro, stated that silicon photonics is becoming a foundational technology for modern digital infrastructure, particularly as artificial intelligence and high-speed data networks continue to expand. He said that the partnership combines CCRAFT’s advanced foundry capabilities and Alcyon’s photonics design expertise with izmomicro’s packaging technology, creating a comprehensive development framework capable of supporting next-generation photonic systems.
According to industry research estimates, the global silicon photonics market was valued at approximately USD 2–3 billion in 2025 and is projected to grow at an annual rate of 25–30 percent in the coming years. The rapid expansion of artificial intelligence infrastructure, data centers, and high-speed communication networks is driving demand for more efficient optical technologies.
izmomicro, headquartered in Bengaluru, operates as the semiconductor packaging subsidiary of izmo Limited, which is listed on the National Stock Exchange and Bombay Stock Exchange. The company provides advanced packaging services including system-in-package (SiP), integrated circuit packaging, RF and microwave assembly, silicon photonics integration, and co-packaged optics. With offices in San Francisco and Cologne, the company is positioning itself as a key participant in the global semiconductor and photonics ecosystem.
