izmo Microsystems Pvt Ltd, the semiconductor subsidiary of IZMO Limited, has developed and manufactured an indigenous high-frequency RF Quad Flat No-Lead (QFN) semiconductor package for devices operating at frequencies of up to 40 GHz. The package has been developed for a customer working on high-frequency RF modules for defence and secure wireless communication applications. Following successful assembly and electrical validation, izmo Microsystems has started production shipments. Its manufacturing processes have also been established to support higher volumes as demand increases.
The development strengthens the company’s capabilities in advanced RF and microwave semiconductor packaging. It also demonstrates its ability to develop application-specific packages and take them from design and fabrication through assembly, validation and commercial production.
High-frequency semiconductor devices face increasing packaging challenges as operating frequencies rise. Conventional molded and open-cavity QFN packages can experience performance limitations because of package parasitics. To address this issue, izmo Microsystems developed a package architecture with optimized trace geometry and die positioning.
The design achieves wire bond lengths of approximately 0.3 mm and incorporates a precision air cavity around the die. This architecture is designed to reduce parasitic effects and support reliable operation at frequencies of up to 40 GHz. The technology has potential applications in radar, electronic warfare, secure communications, aerospace, satellite communications and advanced wireless systems. These areas require semiconductor components capable of reliable operation at high frequencies.
The development also comes as India increases its focus on domestic semiconductor and defence electronics capabilities. Growing defence requirements, greater emphasis on indigenous procurement and the strategic importance of secure communications are creating demand for locally developed technologies.
Dinanath Soni, Director, izmo Microsystems Pvt Ltd, said high-frequency RF devices require semiconductor packages to be designed as an integral part of the RF system. He said the company developed the package around the specific electrical and application requirements of the device and completed the entire process through production. “Production shipments have now commenced, and we have the manufacturing capability to scale as requirements grow,” Mr Soni said.
The company said the focus on advanced semiconductor packaging under the government’s Semicon 2.0 programme could provide further support to the domestic packaging ecosystem. The programme has an approved outlay of ₹1,27,500 crore and includes strengthening the ATMP/OSAT industry.
izmo Microsystems provides package and process development, prototyping, qualification and manufacturing services. Based in Bengaluru, the company works on System-in-Package, advanced IC packaging and high-reliability electronics for defence and aerospace, telecommunications, industrial electronics, automotive, medical electronics and optical communications.
