Texas Instruments (TI) has introduced a new range of isolated power modules designed to improve efficiency, safety and power density in applications such as data centers and electric vehicles. The newly launched UCC34141-Q1 and UCC33420 devices incorporate TI’s proprietary IsoShield technology, a multichip packaging approach that significantly enhances performance compared to conventional discrete designs.
The company is presenting these solutions at the 2026 Applied Power Electronics Conference (APEC), taking place from March 23 to 26 in San Antonio.
According to Kannan Soundarapandian, Vice President and General Manager of High Voltage Products at TI, advances in packaging are reshaping the power electronics landscape. He said the new technology addresses key engineering priorities by enabling smaller form factors, improved efficiency and greater reliability, while also helping reduce development timelines.
IsoShield technology integrates a planar transformer with an isolated power stage into a compact package. This configuration provides various levels of isolation, including reinforced protection, making it suitable for applications with strict safety requirements. The design also supports distributed power architectures, reducing the risk of single-point failures.
The new modules can reduce overall solution size by up to 70 percent while delivering up to 2 watts of power. This enables designers to develop compact systems without compromising performance or reliability.
Such advancements are particularly relevant for data centers and electric vehicles, where space constraints and efficiency demands continue to intensify. In data centers, higher power density allows more computing capability within limited physical footprints, supporting the rapid growth of digital infrastructure. In electric vehicles, compact and efficient power designs contribute to reduced weight, extended driving range and improved system performance.
TI has a long history of investment in power management technologies and continues to expand its portfolio with innovations in packaging. The company now offers more than 350 power modules, supporting a wide range of applications across industries.
At APEC 2026, TI is also showcasing additional solutions, including high-performance automotive reference designs and advanced power distribution systems. These developments underline the company’s ongoing efforts to address evolving power requirements across next-generation technologies.
