Suchi Semicon, Gujarat’s first OSAT provider, has introduced its new QFN series (QFN, uQFN, DFN, XFN) along with a lineup of advanced Power Packages (DPAK, TO-Series, IPAK), broadening its portfolio of semiconductor packaging solutions. The additions are aimed at meeting the rising demand across consumer electronics, automotive systems, electric vehicles, solar energy solutions, industrial electronics, and IoT devices.
With this launch, the company intends to offer chipmakers dependable, locally produced backend packaging solutions—reducing reliance on overseas vendors. Production for the new lines began in January 2025 following extensive R&D and process refinement, with an emphasis on improving performance, heat management, and compactness. The QFN series brings ultra-compact, high-density packaging suited to modern slim-form devices, while the Power Packages cater to applications requiring high current endurance and thermal stability.
Founder and Managing Director Ashok Mehta said the semiconductor sector is entering a stage where both performance and reliability are equally crucial, and packaging now plays a strategic role rather than a support function. He noted that India’s efforts to build a strong semiconductor foundation require domestic OSAT capabilities that can match global quality while offering faster turnaround and closer customer engagement. He added that the new QFN and Power Package families were developed to support a broad spectrum of products—from everyday electronics to high-power EV and industrial devices—delivering dependable performance, long-term durability, and technology suited for future applications.
The QFN family focuses on dense, compact packaging that enables chip designers to pack more functionality into smaller devices without compromising on thermal efficiency or lifespan. These packages support ultra-thin wafers, multiple die-attach choices, fine-pitch gold and copper wire bonding, automated optical inspection, and a zero-delamination process to ensure consistent performance across diverse applications.
The Power Packages are engineered for high-current, high-temperature environments such as EV powertrains, solar inverters, motor drives, and industrial systems. With capabilities like SiC wafer support, soft-solder die attach, thick aluminium wire bonding, and automotive-grade reliability readiness, the lineup is designed to improve heat dissipation, extend service life, and maintain performance even under demanding conditions.
Both package families will serve customers in consumer electronics, IoT, automotive electronics, EV systems, industrial automation, and renewable energy. Production will take place at Suchi Semicon’s OSAT facility in Surat, which is equipped for high-volume manufacturing, tight reliability controls, and quick delivery cycles. Deliveries to domestic and global customers will begin in January. With these additions, the company continues to broaden its portfolio and move further up the semiconductor value chain, reinforcing India’s push to build a secure and competitive semiconductor manufacturing ecosystem.
Suchi Semicon is Gujarat’s first outsourced semiconductor assembly and test (OSAT) company, offering chip packaging and testing at its 30,000 sq ft. Surat facility. Established in 2023, the company began production in 2024 with an initial capacity of 300,000 chips a day, with plans to scale to 3–4 million units daily.
It is investing USD 100 million over three years and targeting more than USD 100 million in revenue in its first phase. The company is also working with Gujarat Technological University and SVNIT to build a skilled workforce, supporting India’s broader semiconductor manufacturing ambitions.
