STMicroelectronics has introduced the ASM330LHHG1, a new automotive-grade inertial measurement unit (IMU) engineered to deliver higher levels of positioning accuracy, motion sensing performance and dead-reckoning capability for next-generation vehicles and intelligent mobility systems. As automotive manufacturers increasingly deploy advanced navigation, telematics, driver-assistance and connected vehicle technologies, the demand for highly accurate motion data has grown significantly.
Modern positioning systems rely on continuous and reliable location information, particularly in situations where Global Navigation Satellite System (GNSS) signals are temporarily unavailable, obstructed or compromised. The ASM330LHHG1 has been developed to address these challenges by providing precise inertial data that supports uninterrupted positioning and navigation performance.
The new device combines a three-axis accelerometer and three-axis gyroscope within a compact package, enabling synchronized motion measurements that improve dead-reckoning calculations and sensor fusion applications. By ensuring consistent timing between sensor outputs, the IMU helps enhance the accuracy of vehicle tracking, route guidance and positioning systems.
Built using ST’s latest microelectromechanical systems (MEMS) technologies, the sensor incorporates low-noise measurement capabilities and integrated temperature compensation. These features contribute to improved stability and reliability across a wide operating range, making the module suitable for deployment in demanding automotive environments where temperatures can reach up to 125 degrees Celsius.
Beyond navigation, the ASM330LHHG1 supports a broad spectrum of vehicle applications. The accelerometer offers measurement ranges up to ±16g, while the gyroscope provides extended sensitivity options ranging from ±125 degrees per second to ±4000 degrees per second with minimal bias drift. These capabilities enable use in vehicle-to-everything communications, telematics systems, electronic tolling, anti-theft solutions, impact detection, crash analysis, ride comfort optimization and vibration monitoring.
To support varying power requirements across vehicle architectures, the device features dedicated high-performance and low-power operating modes. It also incorporates multiple communication interfaces, including I²C, MIPI I3C and SPI, simplifying integration into a wide variety of automotive electronic systems. An integrated 3KB FIFO memory further improves efficiency by reducing processor workload and minimizing power consumption.
Qualified to the AEC-Q100 automotive reliability standard, the ASM330LHHG1 is now in full production and available in a compact 2.5 mm x 3.0 mm LGA package. The launch underscores STMicroelectronics’ continued commitment to advancing semiconductor technologies that support smarter mobility, enhanced safety and more resilient connected transportation systems worldwide.
With approximately 49,000 employees worldwide, STMicroelectronics develops semiconductor technologies for mobility, industrial automation, energy management, and connected devices. The company continues to advance sustainability goals, including its target of achieving carbon neutrality across key operational areas and sourcing 100 percent renewable electricity by the end of 2027.
