izmo Microsystems, a specialised division of izmo Ltd, has developed a high-complexity 3D System-in-Package (SiP) module for space payload camera electronics, achieving a substantial reduction in size and footprint compared with conventional designs. The company re-engineered a traditional 200 mm × 200 mm PCB-based electronic system into a compact SiP module measuring 81 mm × 81 mm, resulting in an 84% reduction in footprint. The design integrates active components in bare-die form onto stacked substrates using high-density wire bonding, enabling high routing density and multi-function integration within a compact volume.
The module is enclosed in a fully indigenised custom hermetic ceramic package, designed and manufactured in India. This packaging solution is engineered to meet space-grade reliability requirements, including resistance to extreme thermal variations and vacuum conditions encountered in space environments.
izmo Microsystems stated that achieving this level of integration presents significant technical challenges, including managing signal integrity and thermal dissipation within a confined space. The successful development demonstrates the company’s capability in advanced semiconductor packaging and heterogeneous integration for mission-critical applications.
The development supports India’s semiconductor and space technology initiatives by reducing dependence on imported packaging technologies. While most System-in-Package solutions are designed for commercial electronics, the company noted that this project represents a move into advanced space-grade 3D integration, a capability currently held by only a limited number of global aerospace suppliers.
The company believes the achievement establishes a strong technical foundation for future applications in areas such as space electronics, silicon photonics and quantum communications, where traditional packaging approaches are insufficient. izmo Microsystems specializes in high-precision chip packaging, including the integration of active auto-alignment and advanced optical systems for next-gen photonic applications.
Their expertise includes custom packaging solutions for fiber-in and fiber-out configurations, high-speed RF integration, and precision positioning technologies. These innovations are crucial for supporting the demands of quantum computing, AI, and next-generation communication systems.
izmo Microsystems, a leading division of izmo Ltd, is renowned for its System-in-Package (SiP) solutions in semiconductor and photonic applications. The company is at the forefront of providing advanced chip packaging, photonic integration, and microelectronics assembly solutions to industries such as telecommunications, AI, quantum computing, and high-speed networking.
