Teledyne e2v has announced the commencement of full-scale production of its 16GB DDR4-X1 Flight Model, marking a significant step forward in the company’s range of high-density, radiation-tolerant memory solutions designed for space applications. This development responds to the increasing demand for advanced onboard computing capabilities driven by next-generation satellite missions.
The 16GB DDR4-X1 Flight Model has been engineered to meet the performance and reliability requirements of modern space systems, including AI-enabled satellites, large-scale constellations, broadband connectivity services from orbit, direct-to-device communication networks, and optical inter-satellite links. By combining high memory density with radiation resilience in a compact form factor, the device supports complex data processing tasks in challenging environments.
Initial samples of the memory device were delivered to customers in October 2025, enabling early-stage system integration and evaluation. The component delivers data rates of up to 2400 MT/s and is built to withstand radiation effects, including single-event latch-up immunity above 43 MeV•cm²/mg and total ionizing dose tolerance up to 35 krad. These characteristics ensure dependable performance in mission-critical conditions.
The device maintains a compact footprint of 15 × 20 × 1.92 mm, consistent with other DDR4 products in the company’s portfolio. Its pin-to-pin compatibility with lower-density variants allows system designers to increase memory capacity without redesigning existing hardware, simplifying upgrade paths and reducing development timelines.
Company representatives highlighted that the transition to production reflects steady progress across the program, supported by completed documentation, radiation testing data, and established customer support resources. These elements are intended to facilitate integration across a wide range of space programs.
The 16GB DDR4-X1 is also incorporated into the Qormino® QLS1046 space computing modules, which combine a radiation-tolerant processor with DDR4 memory to support advanced onboard applications such as artificial intelligence processing, sensor data fusion, and autonomous spacecraft operations.
In addition to the new product, the company’s DDR4 portfolio includes 8GB Flight Models and upcoming NASA Level 1 16GB versions intended for geostationary and long-duration missions, expected to be available in the third quarter of 2026. This expanding portfolio provides satellite developers with flexible memory options aligned with diverse mission requirements while maintaining compatibility and long-term supply continuity.
