Teledyne DALSA, a Teledyne Technologies company and a global supplier of machine vision technology, has announced the launch of its new Linea™ ML 32K line scan camera. The camera has been developed for high-resolution imaging applications, including semiconductor wafer and electronics inspection.
The new Linea ML 32K expands Teledyne DALSA’s Linea ML camera family, which includes 8K and 16K models. The latest camera features 2.5 µm pixels and supports a maximum line rate of 150 kHz, making it suitable for inspection applications where high resolution and fast image capture are required.
The Linea ML family uses a multiline CMOS sensor architecture designed to support different imaging configurations. Depending on the application, the sensor can be configured for single-line, dual-line, trilinear colour or quadlinear multispectral imaging. The architecture also includes sequential exposure capabilities, providing additional flexibility for demanding machine vision applications.
With its 2.5 µm pixel size, the Linea ML 32K is designed to inspect complete 300 mm semiconductor wafers using a single camera. This can help machine builders and inspection system developers achieve high-resolution imaging while reducing the need for multiple cameras in certain applications.
The camera also includes high dynamic range (HDR) and sequential exposure features. These capabilities are designed to improve the detection of small defects and provide better imaging performance across challenging inspection conditions. For high-speed data transmission, the Linea ML 32K uses Camera Link HS® CX4 connectors for Active Optical Cables. The technology provides electromagnetic interference immunity, supporting reliable operation in demanding industrial environments.
The new camera will be demonstrated at VISION 2026 in Stuttgart, Germany, from October 6 to 8. Teledyne DALSA will showcase the Linea ML 32K at Hall 8, Booth 8B10, where visitors can see the camera operating in live inspection applications. Teledyne Vision Solutions brings together a broad portfolio of industrial and scientific imaging technologies. The portfolio includes Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics and Adimec.
The combined portfolio provides customers with imaging, sensing and related technologies for industrial and scientific applications. Teledyne also provides technical support and expertise for customers working on demanding imaging and machine vision requirements. The Linea ML 32K adds a high-resolution option to Teledyne DALSA’s existing Linea ML family and is aimed at applications requiring detailed inspection, fast line rates and flexible imaging configurations.
