Festo India will participate in SEMICON India 2026, taking place September 17–19 at Yashobhoomi, Delhi, where it will present its Seamless Automation approach for semiconductor and electronics manufacturing.Â
The company’s booth, located at Hall 1, Booth 1256, will bring together electric and pneumatic automation, motion control, precision handling, sensing, process control and digitalisation under a single technology portfolio aimed at semiconductor fabs, equipment OEMs and electronics manufacturers.
The semiconductor-relevant offering, by Festo, spans electric automation for repeatable positioning, pneumatic and proportional pressure control for controlled force and motion profiles, and precision wafer handling designed to move substrates with minimal vibration. The lineup also includes wafer alignment and transfer solutions for EFEM and equipment applications, piezo-based technologies for pressure and flow control, and valve solutions for vacuum, gas and fluid handling. Cleanroom-compatible components and condition-monitoring tools round out a portfolio addressing wafer fabrication equipment, sub-fab systems, gas supply, cooling circuits and vacuum technology.Â
Rather than centring its participation on a single product launch, Festo said its focus at the show is on demonstrating how pneumatic, electric, piezo and digital technologies work together in application-specific solutions. Recent developments in this space include high-precision piezo-based pressure control, micro-positioning with force detection, and pin-lift technology that positions wafers to micrometre-level accuracy. One example the company points to is its wafer warpage solution, which uses multi-channel pressure control and closed-loop force feedback to handle warped wafers and substrates.
Festo said its semiconductor technologies target a specific set of manufacturing challenges: wafer damage during handling, vibration during motion, particle contamination in cleanroom environments, and stability during vacuum and process-gas operations. Its cleanroom-compatible products, along with semiconductor-specific seals, greases and double-packaging options, are built for contamination-sensitive settings, while proportional valves and mass-flow control aim to keep process conditions consistent across repeated cycles. On the digital side, the company’s condition-monitoring and predictive-maintenance tools are meant to give machine builders visibility into equipment health rather than just control over individual actuators or valves, an approach that extends to remote I/O, simulation, virtual commissioning and data-driven process optimisation.Â
Festo said the semiconductor sector was among its fastest-growing industrial segments globally in 2025, with India its strongest-growing market. The company operates a Global Production Centre and R&D facility in Krishnagiri, Tamil Nadu, and invested more than 8 percent of its turnover in R&D last year.
“SEMICON India 2026 comes at an important moment for India’s semiconductor journey, as the country moves from building capabilities to creating a more integrated and globally competitive semiconductor ecosystem,” said Ravi Sastry, Managing Director, Festo India. “At Festo, we see automation as a critical enabler of this transformation. India’s semiconductor opportunity is not limited to chip fabrication. It encompasses the entire ecosystem, from wafer processing and equipment manufacturing to advanced packaging, testing, electronics manufacturing and the supporting infrastructure required to build a resilient value chain. We look forward to building long-term partnerships and contributing our automation expertise to India’s journey from Silicon to Systems.”
Festo said it expects the exhibition to generate new customer enquiries, engagement with equipment OEMs, and technology collaborations across front-end, back-end and advanced packaging applications as India’s semiconductor manufacturing base expands. Visitors to Booth 1256 can expect application-oriented demonstrations covering precision motion, wafer and substrate handling, controlled gripping, micro-positioning and digital monitoring.
