Teledyne is set to disclose its latest scientific imaging and machine vision solutions at SPIE’s Photonics West exhibition, scheduled to take place from January 30 to February 1, 2024, in the city of San Francisco, California.
Teledyne Technologies Incorporated serves as a provider of enabling technologies for key industrial growth markets, emphasizing advanced technology and unparalleled reliability. The company’s diverse market presence spans aerospace and defense, factory automation, environmental monitoring for air and water quality, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging, and pharmaceutical research.
One of Teledyne’s revelations at SPIE’s Photonics West exhibition is the introduction of Teledyne e2v’s OnyxMax™, the next generation of the widely acclaimed Onyx 1.3M low-light CMOS image sensor. Engineered for exceptionally low light conditions, down to 1 mLux, the OnyxMax™ sets a new standard for sensitivity and image resolution.
This advancement extends its range, enabling the detection of even minute objects in challenging conditions. The applications for OnyxMax™ span a wide spectrum, including science, defence, traffic cameras, broadcast, surveillance, border control, and astronomy.
Teledyne Photometrics, an important player in the Teledyne Vision Solutions lineup, is set to reveal the Retiga E9 camera. This remarkable piece of technology can capture exposures ranging from tens of microseconds to tens of minutes, delivering detailed, high-resolution images devoid of irrelevant noise.
The Retiga E9 leverages stacked CMOS sensor technology developed by Sony, featuring a square pixel array with 3.76 µm pixels and a high dynamic range exceeding 80 dB. This combination results in a sensitive, versatile, and cost-effective low noise camera, primed for integration or benchtop use.
Meanwhile, Teledyne FLIR IIS is set to debut the Dragonfly® S USB3 series, designed to expedite the inception stage of imaging application development. Addressing the essential need for a modular, compact, and lightweight camera, the Dragonfly S series caters to at-scale manufacturing, volume-based applications, and multi-camera systems.
Visitors to Teledyne’s booth can dive into discussions about hyperspectral imaging, spectroscopy, new technology and applications for CMOS detectors, requirements for thermal sensitivity, comparisons of 3D sensors, and more. The company’s product specialists will be on hand to engage in detailed conversations, offering insights into specific requirements and technological nuances.
Teledyne Vision Solutions is a collective of expertise spanning the entire imaging spectrum. With Teledyne DALSA, e2v, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, and Acton Optics joining forces, the collective offers best-in-class solutions, using their combined strengths to provide the broadest imaging technology portfolio globally.
The innovations showcased range from advanced image sensor platforms, optical modules, and Time-of-Flight (ToF) sensors to high-performance line and area scan cameras, including 3D profile sensors, thermal camera platforms, and AI-enabled vision systems.
Teledyne’s vision solutions are tailored to deliver a unique and competitive advantage across diverse sectors, from industrial inspection and scientific research to spectroscopy and semiconductor solutions.
Teledyne will spotlight a spectrum of cutting-edge products from the various businesses within its Imaging group at booth number 327. Among the key players featured are Teledyne DALSA, e2v, FLIR, Acton Optics, Judson, Lumenera, Photometrics, and Princeton Instruments.
