Teledyne DALSA, one of the leading providers of digital imaging technology, has introduced the Xtium™2-XGV PX8, an image acquisition board designed to support high-speed GigE Vision cameras. This GigE Vision-compatible board incorporates a real-time depacketization engine, facilitating the conversion of GigE Vision image packets into readily usable images. Moreover, it features hardware-assisted packet resend logic, enhancing the reliability of image transfers and reducing CPU overhead. The Xtium2-XGV PX8 is specifically engineered for image acquisition from single or multiple independent 10, 5, 2.5, or 1GigE Vision area scan cameras, line scan cameras, and 3D profile sensors.
Teledyne DALSA, aN entity within Teledyne‘s Vision Solutions group, holds a leading position in crafting, producing, and implementing digital imaging components for machine vision. Its comprehensive range of offerings, including image sensors, cameras, smart cameras, frame grabbers, software, and visionary solutions, serves as the core technology in numerous inspection systems globally, spanning various industries.
Building on the proven technology and performance of Teledyne DALSA’s Xtium2 family, the Xtium2-XGV PX8 stands out as a half-length multi-port 10GigE frame grabber compatible with PCI Express™ Gen 3.0 x8 platforms. This versatile board can support up to 32 cameras across various link speeds and scanning configurations. Available in four or two-port SFP+ configurations, the Xtium2-XGV PX8 delivers an aggregate input bandwidth of 4 GByte/s (4×10 Gb/s) and up to 6.8 GBytes/sec output bandwidth to the host memory. Additionally, it offers on-board format conversions, such as Bayer to RGB and Bi-color to RGB, before transmitting the images to the host computer.
To enhance the reliability of GigE Vision systems, the Xtium2-XGV supports hardware-assisted packet resend and action command for external event synchronization. It is also equipped to transmit/re-transmit IEEE-1588 messages without the need for an external switch. The board supports Sapera™ LT and Teledyne FLIR® IIS’ Spinnaker SDKs, providing users with flexible software development options.
Teledyne DALSA will showcase the Xtium™2-XGV PX8 through a live demonstration at the International Technical Exhibition on Image Technology and Equipment (ITE) in Yokohama, Japan, from December 6 to December 8, 2023. Visitors can explore the capabilities of this innovative frame grabber at Teledyne’s stand D-04 or connect with the team online for further information.
