Teledyne DALSA, a renowned name in digital imaging components for machine vision, is thrilled to unveil the Xtium™2-XGV PX8, an innovative GigE Vision® compatible image acquisition board. This cutting-edge technology is equipped with a real-time depacketization engine designed to seamlessly convert GigE Vision image packets into readily usable images. Notably, it incorporates a hardware-assisted packet resend logic that not only enhances the reliability of image transfers but also reduces CPU overhead.
The Xtium2-XGV PX8 is specifically designed for efficient image acquisition from single or multiple independent 10, 5, 2.5, or 1GigE Vision area scan cameras, line scan cameras, and 3D profile sensors. Leveraging the proven technology and performance of Teledyne DALSA’s Xtium2 family of image acquisition boards, the Xtium2-XGV PX8 stands out as a half-length multi-port 10GigE frame grabber tailored for PCI Express™ Gen 3.0 x8 platforms.
One of the key advantages of this frame grabber is its ability to support up to 32 cameras in various link-speeds and scanning configurations. Available in four or two port SFP+ configurations, the Xtium2-XGV PX8 boasts an impressive aggregate input bandwidth of 4 GByte/s (4×10 Gb/s) and up to 6.8 GBytes/sec output bandwidth to the host memory. Additionally, it offers on-board format conversion features such as Bayer to RGB, Bi-colour to RGB, and more before transmitting images to the host computer.
To ensure a more reliable GigE Vision system, the Xtium2-XGV PX8 introduces hardware-assisted packet resend and action command for external event synchronization. Moreover, it can transmit/re-transmit IEEE-1588 messages without the need for an external switch. The Xtium2-XGV PX8 seamlessly integrates with Sapera™ LT and Teledyne FLIR® IIS’ Spinnaker SDKs, providing users with a versatile and comprehensive solution for their imaging needs.
Witness the live demonstration of the Xtium™2-XGV PX8 at the International Technical Exhibition on Image Technology and Equipment (ITE) in Yokohama, Japan, from December 6 to 8, 2023. Visit Teledyne’s stand D-04 or connect with us online for a deeper understanding of this groundbreaking technology. Teledyne DALSA, as part of Teledyne’s Vision Solutions group, continues to lead the industry with its commitment to designing, manufacturing, and deploying digital imaging components that serve as the core of numerous inspection systems worldwide, spanning across multiple industries.
