ispace, inc (TOKYO: 9348), a leader in lunar exploration, and OrbitAID Aerospace Private Limited, India’s first on-orbit refueling company, have signed a memorandum of understanding to collaborate on sustainable lunar infrastructure. Under this partnership, OrbitAID plans to integrate its Standardized Interface for Docking and Refueling Payload (SIDRP) with ispace’s lunar landers, enabling seamless docking and refueling for upcoming lunar missions. The collaboration will also feature OrbitAID’s innovative refueling propellant payloads, marking a major step toward long-term lunar operations.
The alliance aims to showcase essential capabilities for extending missions in the cislunar environment, supporting longer-duration lunar activities and contributing to a sustainable lunar economy. By combining OrbitAID’s refueling and docking technology with ispace’s lander systems, the partnership will enhance refueling efficiency, recharging, and data transfer, while boosting overall lander performance and reliability. This effort is seen as a key enabler for deep-space exploration beyond Earth’s orbit.
The collaboration strengthens Indo-Japanese space ties, highlighted by upcoming joint missions such as India’s Lunar Polar Exploration (LUPEX) alongside Chandrayaan-5. OrbitAID recently validated its SIDRP interface with a zero-gravity flight test in December 2024 and plans India’s first dedicated in-space refueling demonstration later this year on an SSLV. Takeshi Hakamada, Founder & CEO of ispace, emphasized the shared vision for a sustainable lunar future, while OrbitAID CEO Sakthikumar R highlighted the importance of international cooperation in building the infrastructure needed for deep-space exploration.
ispace specializes in lunar landers and rovers, offering high-frequency, low-cost transportation to the Moon with operations in Japan, Luxembourg, and the US. OrbitAID develops standardized on-orbit refueling and docking solutions to support deep-space exploration, satellite servicing, and sustainable space operations.
