Microchip Technology Inc (Nasdaq: MCHP) has introduced its new BZPACK mSiC® power modules, engineered to deliver high reliability and performance in demanding power conversion environments. The modules are designed to meet stringent High Humidity, High Voltage, High Temperature Reverse Bias (HV-H3TRB) requirements, making them well-suited for industrial and renewable energy applications.
The BZPACK mSiC power modules are tested beyond the standard 1,000-hour HV-H3TRB benchmark, providing enhanced confidence in long-term operation under harsh conditions. Built with a Comparative Tracking Index (CTI) of 600V, the modules offer strong insulation performance along with stable Rds(on) across a wide temperature range. Substrate options include Aluminum Oxide (Al₂O₃) and Aluminum Nitride (AlN), supporting effective thermal management and durability.
Available in multiple configurations such as half bridge, full bridge, three-phase, and PIM/CIB, the modules give system designers flexibility to tailor solutions based on performance, cost, and architecture needs. This range of topologies enables easier adaptation across various high-power applications.
To simplify manufacturing and improve consistency, the BZPACK modules feature a compact, baseplate-less design. Press-fit, solderless terminals and optional pre-applied Thermal Interface Material (TIM) help reduce assembly time and complexity. Industry-standard footprints and pin compatibility further support easier integration and multi-sourcing options.
According to Clayton Pillion, Vice President of Microchip’s High-Power Solutions Business Unit, the new modules reflect the company’s focus on delivering durable and efficient solutions for challenging environments. He noted that the technology supports customers in building systems that are both efficient and long-lasting.
Microchip’s mSiC MOSFET portfolio, including the MB and MC families, complements the new modules with options for industrial and automotive applications. Devices are available with AEC-Q101 qualification and support standard gate-source voltages of 15V or higher. The MC family integrates a gate resistor to enhance switching control and stability, particularly in multi-die configurations. Packaging options include TO-247-4 Notch and die formats.
Microchip Technology Inc develops embedded control and processing solutions designed for secure, connected, and intelligent applications. With a broad product portfolio and streamlined development tools, the company supports efficient system design aimed at reducing development risk, cost, and time to deployment. Serving more than 100,000 customers worldwide, Microchip’s technologies are applied across sectors including industrial, automotive, consumer electronics, aerospace and defense, communications, and computing. Based in Chandler, Arizona, the company maintains a focus on reliable product delivery, high manufacturing quality, and strong technical support.
