Larsen & Toubro’s wholly owned subsidiary, L&T Semiconductor Technologies Ltd (LTSCT), has announced its participation in the imec Automotive Chiplet Program (ACP), a global collaborative research initiative focused on next-generation semiconductor solutions for the automotive sector. The ACP brings together key players across the automotive and semiconductor ecosystem to explore chiplet-based architectures and advanced packaging technologies. The program aims to address growing industry demands around performance, functional safety, reliability, and long-term lifecycle requirements, while enabling scalability and cost efficiency through modular design approaches.
As vehicles evolve toward software-defined architectures, traditional monolithic system-on-chip (SoC) designs are increasingly under pressure. Advanced applications such as ADAS, connected vehicle platforms, and immersive infotainment systems require higher compute capabilities and data bandwidth. Chiplet-based designs—where smaller, function-specific silicon components are integrated using advanced 2.5D and 3D packaging—offer a flexible and efficient alternative.
Dr Sandeep Kumar, Chief Executive of LTSCT, emphasized the significance of this shift, stating that chiplets are transforming how performance and system integration are achieved in modern vehicles. He noted that scalable, modular hardware will play a central role as automotive systems become more software-driven and complex.
Through its involvement in ACP, LTSCT aims to contribute to the development of industry standards and reference architectures for high-performance automotive platforms. The company will focus on areas such as safety-critical computing, high-speed die-to-die connectivity, and comprehensive testing and monitoring across the semiconductor lifecycle—from manufacturing to real-world deployment.
Welcoming the collaboration, Bart Placklé, Vice President of Automotive Technologies at imec, highlighted the importance of collective industry effort. He noted that developing chiplet ecosystems independently would be cost-prohibitive for individual manufacturers. Standardization and interoperability are essential to enable seamless integration of diverse chiplets while improving supply chain flexibility and reducing dependency on single vendors.
The ACP leverages imec’s expertise in advanced semiconductor packaging along with its extensive network of industry partners. LTSCT’s participation marks a strategic step in strengthening India’s position in the global semiconductor landscape. By working alongside international technology leaders, the company aims to support the development of safer, smarter, and more sustainable automotive technologies.
L&T Semiconductor Technologies Ltd (LTSCT), a wholly owned subsidiary of Larsen & Toubro, is a fabless semiconductor multinational focused on designing and delivering innovative solutions and services to global customers. LTSCT specializes in semiconductor devices and solutions, helping clients develop energy-efficient, high-performance systems in line with data, electrification, and software-defined technology trends. The company operates R&D centers in Bangalore, Delhi, and Chennai, with product engineering and sales divisions in Austin, Munich, and Tokyo.
Larsen & Toubro is a USD 27 billion Indian multinational involved in EPC projects, high-tech manufacturing, and services, with operations in over 50 countries. A strong customer-focused approach and a relentless pursuit of quality have enabled L&T to maintain leadership in its key business areas for over eight decades.
