izmo Microsystems, a division of izmo Ltd. (NSE: IZMO), has announced its exclusive partnership with IIT Madras for an innovative project at the Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS), led by Prof. Bijoy Das. The collaboration is part of the Centre of Excellence (CoE) established in January 2021 within the Department of Electrical Engineering at IIT Madras, which received substantial funding from the Ministry of Electronics and Information Technology (MeitY), Government of India, alongside a key in-kind contribution from izmo Microsystems.
This partnership aims to develop advanced packaging solutions for programmable photonic processor cores, leveraging cutting-edge Silicon Photonics technology. The focus of the project is on improving applications in microwave and quantum photonics, a key area of research for future communication and computing technologies.
izmo Microsystems is applying its System-in-Package (SiP) expertise to design, fabricate, and test state-of-the-art packaging solutions for photonic chips. This collaboration plays a pivotal role in advancing the photonic chip packaging capabilities needed to scale chip-based microwave and quantum photonics applications.
Prof Bijoy Krishna Das of IIT Madras highlighted, “izmo Microsystems has been instrumental in advancing the photonic chip packaging for our CPPICS R&D program. Their SiP solutions have been essential in scaling our applications, and we are excited to continue innovating together for energy-efficient and scalable photonic systems.”
This partnership underscores India’s growing focus on semiconductor and photonics innovation, positioning the country as a leader in next-generation computing and communication technologies. Dinanath Soni, Head of izmo Microsystems, expressed his pride in the collaboration, stating, “Partnering with IIT Madras on such an ambitious project is a significant milestone for izmo Microsystems. Our SiP packaging solutions will help ensure the success of this advanced photonic chip, driving the evolution of silicon photonics and semiconductor technologies.”
The global market for silicon photonics is forecasted to grow rapidly, reaching $4.6 billion by 2027, driven by the increasing need for faster data transmission in data centers and cloud computing. This technology addresses the limitations of traditional copper interconnects and supports higher bandwidth and energy-efficient solutions. The Asia-Pacific region, including India, is set to become a key hub for the manufacturing and implementation of silicon photonics, in line with growth in North America and Europe.
Silicon photonics technology is transforming multiple industries by enabling faster, more energy-efficient data transmission and the miniaturization of optical components. Key applications of this technology include telecommunications and data centers, where it enhances bandwidth and reduces latency through advanced optical interconnects. In the fields of AI and machine learning, silicon photonics facilitates optical computing, enabling faster processing of neural networks and deep learning algorithms.
Additionally, silicon photonics is crucial in the development of quantum computing, particularly in quantum communication and secure data processing. It is also making significant strides in biomedical imaging, offering high-resolution imaging that leads to more precise diagnostics in healthcare applications. This technology is driving advancements in both communication and healthcare, shaping the future of these industries.
izmo Microsystems specializes in high-precision chip packaging, including the integration of active auto-alignment and advanced optical systems for next-gen photonic applications. Their expertise includes custom packaging solutions for fiber-in and fiber-out configurations, high-speed RF integration, and precision positioning technologies. These innovations are crucial for supporting the demands of quantum computing, AI, and next-generation communication systems.
izmo Microsystems, a leading division of izmo Ltd., is renowned for its System-in-Package (SiP) solutions in semiconductor and photonic applications. The company is at the forefront of providing advanced chip packaging, photonic integration, and microelectronics assembly solutions to industries such as telecommunications, AI, quantum computing, and high-speed networking.
