izmo Ltd Earns Official DSIR Approval for Its In-House R&D Facility

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Image Courtesy: izmo Microsystems

izmo Ltd has been officially recognized by the Department of Scientific and Industrial Research (DSIR), Government of India, as an approved in-house Research and Development unit. This honor highlights the company’s leadership in advanced semiconductor packaging and its focused efforts in silicon photonics—a technology poised to transform the future of computing and communication.

izmo Ltd has committed significant resources toward developing expertise in silicon photonics packaging. Equipped with a cutting-edge cleanroom in Bangalore, the company excels in advanced design engineering and precision integration. Its research extends across RF, MEMS, power, and photonics packaging, enabling izmo Microsystems, the company’s semiconductor arm, to achieve notable breakthroughs and join a select group worldwide recognized for semiconductor innovation and integration.

Sanjay Soni, Managing Director of izmo Ltd, remarked, “Receiving DSIR approval is a testament to our ongoing commitment to semiconductor packaging innovation and leadership in silicon photonics. With growing demands from AI, cloud computing, and data centers, we are dedicated to advancing India’s role in next-generation packaging technologies critical to future computing.”

Silicon photonics uses light to transfer data at extraordinary speeds, improving bandwidth, reducing latency, and increasing energy efficiency. It is becoming essential infrastructure for AI systems and large-scale data centers, which require rapid and seamless handling of enormous data volumes. Industry estimates place the global silicon photonics market at $2.65 billion in 2025, expected to exceed $9 billion by 2030, growing at over 25% annually.

Packaging technology is key to making these innovations commercially viable by enabling effective integration and scalability. With this DSIR recognition, izmo Ltd plans to leverage government support to accelerate its R&D projects and strengthen its position as a global pioneer in silicon photonics packaging—contributing significantly to India’s role in the worldwide semiconductor industry.

izmo Ltd, through its semiconductor division izmo Microsystems, stands as India’s first dedicated company specializing in silicon photonics packaging and advanced system-in-package (SiP) manufacturing. Based in Bangalore, with a state-of-the-art cleanroom facility, the company offers tailored IC and SiP packaging solutions, reliable RF/MW products, co-packaged optics, and EV/green energy power modules. Drawing on deep engineering know-how and international partnerships, izmo Microsystems delivers innovative packaging solutions for sectors such as high-performance computing, AI infrastructure, telecom, aerospace, and renewable energy—aligning closely with India’s Make in India mission.