Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its 7th generation TRENCHSTOP™ IGBT7 product line with the launch of the CIPOS™ Maxi Intelligent Power Module (IPM) series, designed specifically for low-power motor drives.
The new IM12BxxxC1 series utilizes TRENCHSTOP IGBT7 1200 V technology and rapid diode EmCon 7, offering superior control and performance through its advanced micro-pattern trench design. This results in significant reductions in energy loss, increased efficiency, and higher power density.
The CIPOS Maxi series includes three new models, ranging from 10 A to 20 A, and is suitable for power ratings up to 4.0 kW: IM12B10CC1, IM12B15CC1, and IM12B20EC1. Housed in a compact DIP 36x23D package, the series integrates various power and control components to enhance reliability, optimize PCB space, and lower system costs.
It is recognized as the smallest package for 1200 V IPMs with the highest power density and performance in its class, making it ideal for low-power applications such as motors, pumps, fans, heat pumps, and HVAC systems.
The series offers an isolated dual-in-line molded housing for excellent thermal performance and electrical isolation, meeting stringent EMI and overload protection standards. Additional features include a UL-certified temperature thermistor, a 6-channel SOI gate driver with built-in dead time, under-voltage lockout, and over-current shutdown. The IPM’s multi-function pin allows for high design flexibility, and the accessible low side emitter pins enable easy phase current monitoring.
Infineon Technologies AG is a global leader in semiconductor solutions, focusing on power systems and IoT innovations. Committed to driving decarbonization and digitalization, Infineon employs around 58,600 people worldwide and reported revenue of approximately €16.3 billion in fiscal year 2023. The company is listed on the Frankfurt Stock Exchange (IFX) and the OTCQX International market in the USA (IFNNY).
