Infineon Technologies AG has unveiled the HybridPACK™ Drive G2 Fusion, a groundbreaking power module designed for traction inverters in electric vehicles. This innovative module is the first to integrate both silicon and silicon carbide (SiC) technologies, offering a high-performance, cost-effective solution that enhances vehicle efficiency while keeping costs accessible for a broader market.
By combining the benefits of both materials, the HybridPACK Drive G2 Fusion allows automotive manufacturers to achieve nearly the efficiency of a full SiC system while using only 30% SiC and 70% silicon. This balance helps reduce the overall system cost while maintaining high thermal conductivity, breakdown voltage, and switching speeds—key advantages of SiC over silicon.
“Our HybridPACK Drive G2 Fusion module demonstrates Infineon’s leadership in automotive semiconductors,” said Negar Soufi-Amlashi, Senior Vice President & General Manager of High Voltage at Infineon’s Automotive division. “By blending silicon carbide and silicon, we’re addressing the demand for greater electric vehicle range, delivering a high-performance module with a competitive cost-performance ratio for both system suppliers and manufacturers.”
The HybridPACK Drive G2 Fusion is designed for plug-and-play integration into existing vehicle systems without the need for extensive modifications. Capable of up to 220 kW in the 750 V class, it offers enhanced thermal management and reliability across a wide temperature range from -40°C to +175°C. Infineon’s CoolSiC™ technology, combined with silicon IGBT EDT3 technology, allows for a straightforward transition from full silicon or SiC-based inverters to a fusion inverter design.
Infineon’s expertise in both SiC MOSFET and silicon IGBT technology, along with advanced packaging and sensor integration, enables manufacturers to reduce system costs while maintaining top-tier performance. For example, the integration of XENSIV™ Hall sensors within the module ensures precise motor control, improving overall vehicle efficiency.
At the upcoming electronica event in Munich, Infineon will showcase its latest solutions for tackling today’s global challenges. Visitors will have the opportunity to explore the company’s energy-efficient technologies that drive green and digital transformation, promoting advancements in mobility, sustainable infrastructure, and artificial intelligence. The event runs from November 12 to 15 in Hall C3, Booth 502, under the theme “Driving Decarbonization and Digitalization. Together.”
Infineon Technologies AG is a global leader in power systems and IoT solutions, dedicated to promoting decarbonization and digitalization. The company employs approximately 58,600 people worldwide and reported revenues of €16.3 billion for fiscal year 2023. Infineon is listed on the Frankfurt Stock Exchange (IFX) and the OTCQX market in the USA (IFNNY).
