Continental, a leading technology company, has unveiled a groundbreaking modular and highly scalable solution for integrating high-performance computers (HPC) into vehicle architectures. With its innovative Plug & Play concept, Continental is revolutionizing the market for vehicle manufacturers and suppliers by enabling the replacement or upgrade of individual computing modules, even while the vehicle is in the field. The company’s cutting-edge liquid cooling system further ensures optimal operating temperatures.
The Software-Defined Vehicle (SDV) is driving significant changes in the automotive industry, as more vehicle functions are controlled, monitored, and maintained through software. Analysts predict that the market volume for software-based vehicle functions and services will reach an estimated $640 billion by 2031. To accommodate the growing demands of software-driven features, vehicles require modular and powerful HPCs that can be seamlessly integrated into their electrical and electronic (E/E) architecture.
Jean-Francois Tarabbia, head of the business area Architecture and Networking at Continental, emphasized the company’s focus on flexibility and scalability, stating, “We are dedicated to providing a flexible and scalable concept for cross-domain HPCs, along with an innovative cooling solution suitable for all vehicle classes. Our Plug & Play solution reduces the complexity of the vehicle architecture, wiring harness, and installation space while allowing for the exchange and upgrade of individual computing modules in the field.”
Continental’s HPC solution offers adaptability and customization, catering to diverse customer requirements. The emphasis on modularity enables various HPC modules to be combined in different configurations, allowing the computing power to be scaled according to specific needs. Vehicle manufacturers have the flexibility to integrate individual HPCs or utilize modular stack or rack solutions, combining different HPC modules into a single unit.
The integration of multiple modules within a single box reduces the need for extensive cabling, particularly for high-speed data exchange. Thanks to the Plug & Play approach, individual computing modules can be effortlessly exchanged in the field, similar to graphics cards or hard disks in traditional desktop computers. This not only simplifies the upgrading process but also offers cost-effective repair solutions.
Addressing the challenge of dissipating the significant heat generated by HPCs, Continental has developed a state-of-the-art cooling concept. With power dissipation reaching up to 1KW, depending on the application, efficient liquid cooling is crucial to maintaining safe operating temperatures. The company’s groundbreaking cooling system employs flexible cooling pads that conform to the HPC modules under fluid pressure, eliminating air gaps and facilitating the effortless replacement of modules. This advancement significantly streamlines the replacement process and enhances cost-effectiveness for repairs and upgrades.
Continental continues to lead the industry with its pioneering technologies and services for sustainable and connected mobility. Established in 1871, the company focuses on providing safe, efficient, intelligent, and affordable solutions for vehicles, machines, traffic, and transportation. With sales of €39.4 billion in 2022 and approximately 200,000 employees in 57 countries and markets, Continental remains at the forefront of shaping the future of mobility.
