CADFEM APAC and SilTerra Malaysia Sdn Bhd have entered into a strategic collaboration aimed at advancing semiconductor development through simulation-driven engineering, digital design methodologies, and enhanced manufacturing integration. The partnership, formalized through a Memorandum of Understanding (MoU), brings together CADFEM APAC’s expertise in engineering simulation and predictive digital development with SilTerra’s extensive capabilities in semiconductor fabrication, process technologies, and design services.
As semiconductor technologies become increasingly complex, manufacturers face growing pressure to shorten development cycles, improve design accuracy, and reduce production risks. The collaboration seeks to address these challenges by creating a more connected and efficient pathway from concept development to commercial silicon production.
A central focus of the partnership is the advancement of Design-Technology Co-Optimization (DTCO) and System-Technology Co-Optimization (STCO) methodologies. These approaches integrate design, process, and device development into a unified digital framework, enabling earlier validation of concepts, faster design iterations, and stronger alignment between simulation models and manufacturing outcomes.
Under the agreement, CADFEM APAC will contribute advanced multiphysics simulation capabilities covering thermal behavior, electrical performance, material interactions, device variability, and system-level analysis. SilTerra will provide process expertise, fabrication insights, and characterization data to ensure that virtual engineering models accurately reflect real-world manufacturing conditions.
The collaboration also aims to support emerging semiconductor technologies, particularly in areas where increasing computational requirements are driving demand for improved bandwidth and energy efficiency. SilTerra is currently advancing optical interconnect technologies integrated with silicon architectures to address data transfer and power consumption challenges associated with next-generation computing platforms.
In addition, both organizations will explore the application of Agentic Artificial Intelligence technologies to enhance semiconductor development workflows. Areas of focus include natural language processing, retrieval-augmented generation, AI-assisted electronic design automation environments, and process design kit integration.
These technologies are expected to streamline engineering workflows, improve cross-functional collaboration, and accelerate the transition from concept development to manufacturable semiconductor products. The alliance will also establish a continuous feedback mechanism between design simulation and fabrication processes, improving model accuracy, accelerating validation, and strengthening confidence in manufacturing outcomes.
Beyond technology development, the partnership aims to support the broader semiconductor ecosystem through industry engagement, knowledge sharing, and practical engineering initiatives. By combining predictive engineering tools with manufacturing expertise, CADFEM APAC and SilTerra are positioning themselves to help accelerate semiconductor innovation while reducing development complexity and enabling faster commercialization of advanced technologies for global markets.
