Nidec Machine Tool America Rebrands Additive Manufacturing Division as Advanced Manufacturing Technologies

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Image Courtesy: NIDEC

Nidec Machine Tool America has announced the rebranding of its Additive Manufacturing division to Advanced Manufacturing Technologies, reflecting a broader strategic focus on delivering integrated, high-precision manufacturing solutions across the region. The newly formed division brings together three core technology platforms under a unified structure, enabling customers to access a wider range of advanced capabilities. These include LAMDA, the company’s metal additive manufacturing system; ABLASER, a precision laser micromachining solution; and BOND MEISTER, a wafer bonding system designed for semiconductor and MEMS applications.

The rebranding aligns with evolving industry demands for integrated manufacturing technologies that combine additive processes, microfabrication and semiconductor-level precision. By consolidating these solutions into a single division, the company aims to simplify adoption and enhance accessibility for customers seeking advanced production capabilities.

The LAMDA platform is a laser powder directed energy deposition system designed for large-scale metal 3D printing. It supports a range of applications requiring robust build volumes and advanced process control. Equipped with real-time monitoring and anomaly detection capabilities, the system ensures consistent build quality while enabling efficient production workflows. Its localized shielding design allows processing of reactive materials without the need for complex enclosures, improving operational flexibility.

The ABLASER system is engineered for ultra-precise micromachining applications. It uses specialized optical technology to enable high-accuracy drilling and shaping of micro-scale features in materials such as silicon, silicon carbide and ceramics. The system supports complex geometries while maintaining minimal thermal impact, making it suitable for high-precision industrial and electronic applications.

BOND MEISTER is designed for wafer bonding processes that require high accuracy without the application of heat. Operating in a vacuum environment, it enables the bonding of dissimilar materials while minimizing stress and distortion. The system is available in multiple configurations, supporting applications ranging from research and prototyping to high-volume semiconductor manufacturing. All three technologies are supported by Nidec Machine Tool America’s established sales and service network across North America, ensuring technical assistance and operational support for customers.

The transition to the Advanced Manufacturing Technologies division reflects the company’s commitment to innovation and its focus on addressing the growing complexity of modern manufacturing. By combining multiple advanced solutions within a single framework, Nidec aims to support customers in achieving greater precision, efficiency and scalability across a wide range of industries.