ZF and SiliconAuto have jointly unveiled a next-generation I/O interface chip and companion microcontroller at the Embedded World 2026 exhibition in Nuremberg, Germany. The new solution represents a significant advancement in automotive high-performance computing and has been recognized with the Embedded Award 2026 in the SoC/IP/IC design category.
The demonstration marks the first live implementation of real-time sensor data acquisition and pre-processing directly on silicon, a development expected to play a key role in enabling advanced driver assistance systems (ADAS) and higher levels of automated driving.
The architecture combines ZF’s newly developed I/O interface chip with SiliconAuto’s XMotiv M3 microcontroller, which functions as a safety controller. The system is designed to manage critical operations such as secure boot, power sequencing, clock control, and system monitoring, ensuring reliable performance in automotive environments.
The I/O interface chip integrates multiple sensor interfaces and supports real-time data processing capabilities, including camera image signal processing and radar signal processing. By handling these tasks at the interface level, the system reduces the computational burden on central processing units within high-performance automotive computers.
A defining feature of the solution is its modular and scalable design. Unlike traditional monolithic system-on-chip architectures, the new approach allows automotive manufacturers to select and integrate preferred computing platforms using standardized high-speed interfaces such as PCIe and Ethernet. This flexibility supports a wide range of applications, from entry-level driver assistance systems to advanced autonomous driving solutions.
The architecture is also designed to improve energy efficiency by minimizing data transfers to memory and optimizing processing workloads. By offloading sensor-related tasks, the system enables core processing units to focus on perception and decision-making functions, enhancing overall system performance.
Another key advantage is its upgradeability. The modular design allows individual components to be updated without requiring a complete system redesign, extending the lifecycle of automotive computing platforms and supporting future technology integration.
Looking ahead, the platform is expected to evolve toward a chiplet-based architecture using open standards such as Universal Chiplet Interconnect Express (UCIe). This approach will enable greater design flexibility, allowing manufacturers to independently upgrade compute, AI, and I/O components while maintaining system compatibility.
The development has been supported by Germany’s Federal Ministry for Education, Research and Space under a program focused on advancing secure and sustainable microelectronics. The initiative reflects broader efforts to strengthen technological capabilities and promote energy-efficient solutions in mobility.
ZF, a global technology company serving automotive and industrial sectors, continues to invest in advanced mobility solutions aimed at enhancing safety, reducing emissions, and enabling next-generation transportation systems. The collaboration with SiliconAuto highlights a shared commitment to innovation in automotive computing and the future of autonomous mobility.
