Teledyne Adimec and Teledyne DALSA, companies within Teledyne Technologies Incorporated (NYSE: TDY) and part of Teledyne Vision Solutions, will showcase a new 100 Gbit/s imaging platform based on Sony’s IMX927 image sensor at VISION Stuttgart 2026, scheduled from October 6 to 8 in Stuttgart, Germany. The technology will be demonstrated at the Teledyne Vision Solutions booth, Hall 8, Booth 8B10.
Designed for advanced semiconductor inspection and metrology applications, the platform combines Teledyne Adimec’s S-105A110 camera with Teledyne DALSA’s upcoming Xtium3-QSFP28 frame grabber. Together, the two products provide a high-bandwidth imaging path from image capture through host-side processing, addressing the growing data and throughput requirements of semiconductor manufacturing.
Based on Sony’s IMX927 image sensor, the S-105A110 delivers 105 MP resolution at up to 110 frames per second and features a CoaXPress over Fiber interface. The camera is designed for applications requiring sustained high data rates, high image quality and thermal stability. Its thermal management capabilities support consistent operation, while factory-calibrated image correction is designed to provide reliable image quality from the outset.
The Xtium3-QSFP28 frame grabber complements the camera with dual QSFP28 connectivity, PCIe Gen 4 host interface support and data-forwarding capabilities. This architecture enables system developers and integrators to manage high-volume image data while supporting scalable image-processing configurations and reducing integration complexity.
The need for higher-performance inspection systems is being driven in part by the continued expansion of artificial intelligence and high-performance computing. As semiconductor devices and advanced packaging technologies become larger and more complex, inspection systems increasingly need to cover wider fields of view while capturing greater levels of detail without reducing throughput. These requirements are driving demand for high-resolution sensors, faster camera interfaces and scalable data-processing infrastructure.
Prototype units of the new imaging platform are expected to be available for evaluation in the first quarter of 2027. Teledyne Adimec has acknowledged the European ENTERTAIN project for its contribution to the development of the 100 Gbit/s imaging platforms.
Teledyne Vision Solutions brings together a broad portfolio of industrial and scientific imaging technologies from Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics and Adimec. The businesses combine decades of imaging expertise and technologies across sensing, imaging and related applications, supported by global customer service and technical capabilities.
Teledyne Technologies Incorporated (NYSE: TDY) provides digital imaging products and software, instrumentation, aerospace and defence electronics, and engineered systems. Its operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe.
