Northrop Grumman (NYSE: NOC) is advancing high-power microelectronics for defence applications through a $7 million contract under the Defense Advanced Research Projects Agency (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) programme. The contract covers Phase 2 of the programme and focuses on integrating diamond-based cooling technology into next-generation semiconductor devices. The technology is being developed to help military radar, communications and other high-performance systems operate at higher power levels without the overheating limitations faced by conventional electronics.
Heat is a major challenge for modern radio frequency (RF) devices. Many systems must operate below their maximum capability to control temperatures, which can limit power output, reduce operating life and affect reliability during demanding missions. Diamond offers a potential solution because of its exceptional ability to conduct heat.
Northrop Grumman is integrating microscopic diamond structures directly into semiconductor devices to move heat away from areas where it builds up. During Phase 1 of DARPA’s THREADS programme, Northrop Grumman achieved a 3.3-fold increase in power. The company’s Phase 2 effort aims to increase power capability by more than three times again while maintaining a compact device footprint.
Ben Heying, director of microelectronics at Northrop Grumman’s Space Park Foundry, said thermal limits have traditionally restricted the performance of high-power microelectronics. “Embedding diamond directly into chips works like a turbocharged cooling system. It keeps the chips cool so we can increase the power without the risk of burnout,” Mr Heying said.
Northrop Grumman is working with Stanford University to develop the technology. Under the approach, a diamond layer is grown on the backside of the semiconductor device and integrated into microscopic channels. These diamond-filled channels help transfer heat away from high-temperature areas.
The company said the technology could support stronger RF transmitters for military communications and satellite links while also creating opportunities for other future defence applications. Northrop Grumman’s diamond research builds on work that began in 2019. The company has been studying the use of diamond’s high thermal conductivity and ability to withstand extreme temperatures to overcome conventional semiconductor cooling limitations.
The work is being carried out through Northrop Grumman’s Microelectronics Center, where the company designs, manufactures, assembles, tests and packages microelectronics for defence and commercial systems. The company produces millions of microelectronic devices annually and maintains capabilities spanning semiconductor design, fabrication, testing and packaging. Its microelectronics technologies support a range of mission-critical systems.
The THREADS programme forms part of broader efforts to improve the performance of next-generation electronics by addressing heat removal at the device level. Northrop Grumman said the Phase 2 programme will build on the results achieved during earlier development and move diamond-based cooling technology closer to practical use in high-power semiconductor systems. The company is a global aerospace and defence technology provider developing systems for national security, space exploration and other demanding applications.
