Turkish e-Passports have made a ground-breaking news as Turkey issued nearly five million next-generation electronic passports, incorporating Infineon Technologies AG’s (FSE: IFX / OTCQX: IFNNY) innovative Coil on Module (CoM CL) solution. This cutting-edge technology, designed to meet the highest security standards, has resulted in an ultra-thin electronic data page that ensures exceptional durability and protection against forgery.
The Turkish passports feature a polycarbonate (PC) data page housing an integrated security chip embedded in a contactless module based on Infineon‘s reliable CoM technology. This data page contains sensitive personal information, underscoring the critical need for the highest security standards to prevent tampering and fraud. Infineon’s contactless CoM solution not only bolsters the robustness of the electronic passport but also elevates its overall security.
Maurizio Skerlj, Vice President of Authentication & Identity Solutions at Infineon’s Connected Secure Systems Division, affirmed their commitment for being a reliable partner of Turkey. Focusing on Infineon’s role as a trustworthy ally to Türkiye, Skerlj ensures the smooth integration of their security components into the latest government identity eDocuments. Skerlj has also highlighted the significant achievement of the new eDatapage, which is super thin at just 630 µm, making it one of the world’s slimmest.
Coil on Module Technology Enhances Security and Reliability
Infineon’s Coil on Module contactless packaging technology is a revolutionary solution designed for highly robust and flexible government IDs and passport documents. These travel documents demand the utmost security and durability over their typical ten-year lifespan. The inductive coupling technology employed in this packaging solution establishes a wireless connection between the module and the antenna embedded in the document, akin to the communication between a card and a contactless card reader. This significantly enhances the robustness of the electronic data page.
Moreover, Infineon’s FCOS™ (Flip Chip on Substrate) manufacturing technology enables the production of a module with a remarkable thickness of only 125 µm, making it up to 50 percent thinner than conventional contactless modules. This advancement allows for the creation of ultra-thin antenna inlays, approximately 200 µm thick, for passport eDatapages measuring around 500 µm in total thickness. This reduced thickness provides the issuing state printer the flexibility to embed additional security layers in the ePassport’s PC eDatapage, meeting the highest security standards.
Turkish ePassports: Why Anti-Forgery Measures Are Now Imperative
With Turkey’s population reaching nearly 86 million by 2023 and continuing to grow, there is an increasing demand for fraud-resistant passports. The standout feature of the new Turkish ePassports is the ultra-thin electronic PC data page, measuring only 630 µm in thickness—a testament to its exquisite design, robustness, and enhanced security features that combat fraud effectively. The Turkish ePassport is set to be showcased at Infineon’s booth at TRUSTECH 2023.
Infineon’s Coil on Module technology represents a significant leap forward in electronic passport design, elevating security standards and setting a new benchmark for durability and innovation. Turkey’s adoption of this advanced technology underscores its commitment to providing its citizens with state-of-the-art and highly secure travel documents, reinforcing the nation’s stance in the forefront of technological advancements in the realm of electronic identification.
