TRUMPF 3D Printing Technology Helps Semiconductor Manufacturers Cut Costs

Semicon_Application_Example_Water manifold
Image Courtesy: TRUMPF

TRUMPF advanced additive manufacturing (AM) technology is enhancing the precision and efficiency of semiconductor production systems, enabling manufacturers to cut costs and reduce waste. “Using additively manufactured components increases the functionality and precision of semiconductor production equipment, paving the way for more cost-effective manufacturing,” said Marco Andreetta, head of the semiconductor division at TRUMPF.

As the semiconductor industry demands machines with nanometer-level precision, even minor deviations can lead to costly scrap. At Formnext, the leading additive manufacturing trade fair in Frankfurt, TRUMPF will showcase sample parts tailored for semiconductor manufacturing, including 3D-printed manifolds for fluid and gas lines.

Benefits of Additive Manufacturing in Semiconductor Production

In semiconductor production, complex machines require each component to perform with exceptional precision. Traditional fluid manifolds, for example, tend to be bulky, with abrupt fluid paths that can lead to pressure drops and leakage, impacting machine performance.

“With additive manufacturing, semiconductor equipment suppliers can consolidate multiple parts into a single component, enhancing reliability and efficiency,” Andreetta explained. By optimizing manifold designs, TRUMPF’s AM technology creates lighter, stiffer parts with minimized pressure drops, mechanical disturbances, and flow-induced vibrations, all crucial for high-performance semiconductor machinery. The design flexibility of AM also reduces leakage risks and boosts part durability.

Precision and Quality with TRUMPF’s Advanced Monitoring Technology

Achieving the quality demanded in semiconductor manufacturing parts is a challenge for any technology. TRUMPF’s solution includes a comprehensive monitoring system for 3D printing, with automatic multi-laser alignment (AMA) and melt pool monitoring. AMA enables TruPrint users to perform automated online alignment of laser paths with micrometer accuracy, ensuring precision and consistency. At Formnext 2024, TRUMPF will unveil the latest AMA release, featuring faster data capture and refined alignment capabilities. The system captures the relative position of master and slave lasers, automatically adjusting between production layers as per user preference.

Additionally, TRUMPF’s melt pool monitoring observes the printing process in real time, helping to ensure quality while potentially reducing the need for costly non-destructive testing (NDT) like post-production CT scans. “Real-time monitoring of the melt pool helps manufacturers maintain quality standards and reduce expenses,” Andreetta added.