Tessolve, a global engineering firm specializing in end‑to‑end silicon-to-system solutions for smart, connected devices, has become a member of the eSync Alliance, a non-profit trade organization that promotes standardization for Over-the-Air (OTA) updates and diagnostics in automotive electronics. Through this tie-up, Tessolve strengthens its offering in the automotive domain—integrating its TERA Edge HPC gateway, TCU clusters, and onboard diagnostic systems—toward a unified, software-defined vehicle environment for OEMs and Tier-1s.
This alliance underscores Tessolve’s strategy of engaging with industry groups and partnerships to support the evolution of secure, connected, and software-centric vehicles. Tessolve’s contribution will enhance compatibility with the eSync Alliance’s three-layer server-client-agent structure, ensuring smooth operation across microcontrollers, ECUs, gateways, and cloud platforms.
By working together, Tessolve and the eSync Alliance aim to deliver interoperability, compliance with cybersecurity and regulatory mandates, and streamlined software updates—to help automakers and suppliers get connected systems to market faster. This collaboration supports scalable architectures that cover embedded hardware, connectivity, and cloud integration.
Srini Chinamilli, Co‑founder & CEO of Tessolve, said “Joining the eSync Alliance solidifies our ability to provide seamless OTA and diagnostic frameworks across the vehicle ecosystem. By combining Tessolve’s embedded systems know-how with TERA gateway, cluster, and secure connectivity platforms, we’re accelerating the deployment of scalable and future-ready architectures for intelligent mobility.”
Mike Gardner, Executive Director of the eSync Alliance, remarked “Our mission is to build secure, standardized data pathways from ECUs and sensors to the cloud. Tessolve’s expertise across silicon, software, validation, cybersecurity, and system design helps us push that vision forward. We’re excited to have them onboard and to collectively drive innovation within our ecosystem.”
As the automotive industry shifts toward software-defined platforms, the demand for reliable, interoperable, and future-proof systems is rising. This collaboration affirms Tessolve’s role in building intelligent, secure, globally deployable solutions for the future of mobility.
Tessolve delivers turnkey silicon and system solutions with both hardware and software capabilities. From pre- and post-silicon design, packaged parts, testing, and system integration, Tessolve supports clients through the full product lifecycle. Its R&D focus includes high-performance computing, photonics, high-speed interfaces, 5G, and more. Key markets include automotive, avionics, data centers, industrial/IoT, and semiconductors.
With deep engineering resources, Tessolve helps accelerate time‑to‑market for complex designs. The eSync™ Alliance is a collaborative, non-profit trade body that enables standardized OTA software updates, diagnostics, and data exchange in automotive electronics. Adopted in millions of vehicles globally, the eSync protocol provides a unified, secure bi-directional pipeline for remote updates and telematics—reducing the need for multiple custom OTA solutions and lowering integration costs for OEMs and Tier‑1 suppliers.
