Teledyne e2v has announced the successful space qualification of its 8 GB DDR4 memory chip, designed to meet the growing demand for high-density, reliable memory in space-based applications. The completion of this qualification process includes rigorous testing, such as temperature cycling, construction analysis, acoustic microscopy, and radiation testing, ensuring the memory chip’s suitability for the harsh conditions of space.
As modern satellites require increasingly compact and powerful components, Teledyne e2v emphasizes that its new 8 GB memory chip is compatible with a wide range of high-end space processing units. These include processors from AMD/Xilinx VERSAL® ACAP, space FPGAs, MPSOCs, Microchip RT PolarFire®, and various custom ASICs.
The 8 GB DDR4 memory chip offers double the storage capacity of its predecessor while maintaining the same physical form factor and pin compatibility. This makes it an ideal choice for next-generation satellite designs, where size, power efficiency, and data storage are critical factors.
With the ability to support a transfer rate of 2400 MT/s and its immunity to single-event latch-up (SEL) up to 60 MeV.cm²/mg, the new memory chip is built to handle the demands of modern space missions. It also provides a total ionizing dose (TID) tolerance of 100 krad, making it a robust solution for data-intensive satellite payloads that require reliable memory performance in challenging environments.
Teledyne e2v continues to lead in providing innovative solutions across various sectors, including space, healthcare, defense, and industrial markets. By closely collaborating with customers to address their specific challenges, Teledyne e2v delivers tailored memory solutions that enhance the value and performance of their systems.
