Teledyne e2v has introduced an upscreened version of its LX2160 processor, designed for high-reliability aerospace and defense applications. This new processor operates effectively in extreme temperatures ranging from -55°C to +125°C. Featuring a 16-core Arm® Cortex® A72 architecture, the LX2160 offers exceptional performance for AI-at-the-Edge computing, single board computers (SBCs), and other demanding embedded systems.
The LX2160 processor surpasses its predecessor, the LS1046 quad-core processor from NXP’s 64-bit Arm® Layerscape series, with a notable increase in efficiency. The new processor delivers 2.6 times more Giga instructions per Watt, along with four times as many cores and six times the DMIPS (201k DMIPS @ 2.2 GHz).
This boost in performance is complemented by advanced features such as 2 DDR4 interfaces, 100 GbE, multiple PCIe Gen3.0 lanes, and SATA Gen3.0 support, which enhance data switching and routing capabilities. Additionally, the LX2160 facilitates an easier transition for developers upgrading from earlier Arm®-based systems.
The military-grade qualification ensures that the LX2160 meets rigorous standards for durability and performance across a broad temperature spectrum. It is encased in a compact 40mm x 40mm package, optimizing space and simplifying installation. Teledyne e2v also guarantees support for the LX2160 processor for over 15 years, mitigating common obsolescence issues.
Thomas Guillemain, Marketing and Business Development Manager of Digital Processing Solutions at Teledyne e2v, stated, “The introduction of the military-qualified LX2160 processor allows us to offer unparalleled performance to our aerospace and defense clients for their high-demand applications. We are also developing a space-qualified version of the LX2160, set for release next year.”
Teledyne e2v continues to advance innovations across various sectors, including healthcare, space, transportation, defense, and industrial markets, by addressing customer needs with standard, semi-custom, or fully custom solutions.
