Teledyne DALSA, a global leader in machine vision technology and a Teledyne Technologies company, has announced the launch of the Linea HS2 8k backside illuminated (BSI) Time Delay Integration (TDI) camera, expanding its advanced Linea HS2 camera portfolio. The new model is engineered to deliver exceptional imaging performance in applications requiring ultra-high-speed inspection under challenging low-light conditions.
The Linea HS2 8k camera complements the existing 16k variants and combines high sensitivity, superior image quality, and a maximum line rate of 1 MHz. Featuring a 5 µm pixel resolution, the camera is designed to meet the growing demands of industries where precision inspection and rapid throughput are critical.
At the core of the camera is Teledyne DALSA’s proprietary CMOS BSI TDI sensor technology. The multi-array charge-domain sensor architecture provides users with the flexibility to optimize performance based on specific inspection requirements. Depending on application needs, the camera can be configured to maximize line rate, dynamic range, or full well capacity while maintaining exceptional signal integrity and image quality.
The Linea HS2 family is available in both 8k and 16k resolutions and offers enhanced quantum efficiency to support current and emerging machine vision applications. This advanced sensor design enables reliable detection of fine details in environments where illumination is limited, helping manufacturers improve inspection accuracy and operational efficiency.
The new camera is particularly suited for demanding applications such as semiconductor wafer inspection, high-density interconnect analysis, genomics flow cell imaging, and other high-speed automated inspection processes. Integrated on-chip binning capabilities further increase imaging sensitivity and allow higher web speeds, contributing to improved production throughput and reduced inspection times.
To support robust industrial deployment, the Linea HS2 8k camera incorporates Camera Link HS CX4 connectivity for Active Optical Cables, ensuring complete immunity to electromagnetic interference and enabling reliable data transmission in electrically noisy environments. The launch reinforces Teledyne DALSA’s commitment to advancing machine vision technology through innovative imaging solutions that address the evolving needs of manufacturers and research organizations worldwide.
As part of Teledyne Vision Solutions, Teledyne DALSA contributes to one of the industry’s most comprehensive portfolios of industrial and scientific imaging technologies. Supported by global technical expertise and customer service resources, the company continues to develop solutions that help organizations achieve higher performance, greater inspection accuracy, and enhanced operational competitiveness across a wide range of industries.
