Tata Consultancy Services (TCS), a global leader in IT services, consulting, and business solutions, announced the launch of its Chiplet-based System Engineering Services. The new offering is designed to help semiconductor companies overcome the limitations of traditional chip design and deliver faster, more efficient, and powerful processors.
Chiplets—small integrated circuits used as modular building blocks—enable flexible, scalable, and cost-effective design approaches. This innovation comes at a time when global demand for advanced semiconductors is at an all-time high, driven by AI, cloud computing, smartphones, electric vehicles, and connected devices.
India’s semiconductor market, valued at $45–50 billion in 2024–25, is projected to more than double to $100–110 billion by 2030. With government backing through the ₹76,000 crore India Semiconductor Mission and significant private investments, the country is rapidly emerging as a global hub for chip design and manufacturing.
Already home to 20% of the world’s chip design engineers, India is poised to strengthen its role in the global semiconductor ecosystem. TCS’ new services are expected to accelerate this momentum, offering world-class chip-to-system engineering expertise to both Indian and international companies.
As shrinking transistors on monolithic chips becomes increasingly difficult, the industry is transitioning to chiplet-based design. This approach enables companies to integrate multiple smaller chips tailored for specific needs, reducing costs and speeding up time to market.
“TCS Chiplet-based System Engineering Services will help semiconductor enterprises accelerate chiplets tape-out, driving flexibility, scalability, and faster time to market,” said V Rajanna, President, Technology, Software and Services, TCS. “With our contextual knowledge, next-gen technology investments, and execution excellence, we are the preferred partner for driving innovation at scale.”
In a recent engagement, TCS partnered with a leading North American semiconductor firm to modernize its design approach using chiplet-based methods. This enabled the client to streamline heterogeneous device integration and speed up delivery of industry-leading AI processors.
TCS is also advancing industry standards by providing comprehensive design and verification of UCIe™ (Universal Chiplet Interconnect Express™) and HBM (High Bandwidth Memory). Its expertise spans advanced package design, including 2.5D/3D interposers and multi-layer organic substrates, enabling next-generation multi-chip products with superior signal integrity, lower latency, and compact form factors.
With more than two decades of semiconductor experience and a robust partner ecosystem, TCS has built a comprehensive chip-to-system engineering portfolio. This initiative aligns with its six-decade legacy of supporting India’s technology revolution, from digital public infrastructure to citizen services.
Globally, TCS serves as a trusted digital transformation partner for industry leaders. With over 600,000 employees across 55 countries and revenues of USD 30 billion in FY25, the company continues to create long-term value for clients, investors, employees, and communities. TCS also champions global health and community empowerment by sponsoring 14 of the world’s most prestigious marathons, including the New York City, London, and Sydney Marathons.
