Tata Electronics has entered into an agreement with ASMPT Singapore to develop semiconductor assembly equipment infrastructure and solutions for its chip packaging facilities in Assam and Karnataka. Under the agreement, ASMPT will support Tata Electronics with workforce training, enhancing service engineering infrastructure, automation, spare parts support, and advancing research and development in areas such as wirebond, flip chip, advanced packaging, and integrated system packaging.
In a statement released on Tuesday, Tata Electronics said, “This collaboration is a key step in preparing for the launch of its semiconductor assembly and test facilities in Vemagal, Karnataka, and Jagiroad, Assam.” Tata Electronics is currently investing Rs 27,000 crore in a chip assembly plant in Assam, set to become operational next year, and has already established a smaller unit in Karnataka.
“This partnership focuses on essential training programs, advanced R&D, and fostering a robust semiconductor ecosystem in India,” said Randhir Thakur, Managing Director and CEO of Tata Electronics. He added that energy and material efficiency will be a priority to ensure sustainable growth in the sector.
ASMPT’s Group CEO, Robin Ng, expressed excitement about the partnership, stating, “By combining our expertise, we aim to contribute to the growth of India’s electronics supply chain and drive innovation in the semiconductor industry.”
Tata Electronics is also establishing a semiconductor fabrication facility in Dholera, Gujarat, alongside its OSAT (Outsourced Semiconductor Assembly and Test) plant in Assam, with a total investment of Rs 1,18,000 crore. These projects are expected to create approximately 50,000 direct and indirect jobs.
