STMicroelectronics has launched the Teseo VI series of global navigation satellite system (GNSS) receivers, designed to provide highly accurate positioning solutions for a variety of industries. These new receivers are set to play a pivotal role in automotive systems, particularly in advanced driving assistance systems (ADAS), smart in-vehicle systems, and autonomous driving applications. They are also tailored for industrial uses such as asset tracking, mobile robotics for home deliveries, machinery management, crop monitoring in agriculture, and timing systems like base stations.
Luca Celant, General Manager of Digital Audio and Signal Solutions at STMicroelectronics, highlighted the breakthroughs the Teseo VI series brings: “These receivers are the first to combine multi-constellation and quad-band signal processing in a single die, incorporating a dual-Arm®-core architecture to ensure high performance and safety for both assisted and autonomous driving applications. They also feature ST’s proprietary embedded Non-Volatile Memory (PCM), offering a highly integrated, cost-effective platform for precise positioning solutions.”
The Teseo VI is the first solution in the market to integrate all system elements necessary for centimeter-level positioning accuracy into a single die, supporting multi-constellation and quad-band operations simultaneously. This innovation streamlines the development of navigation products, enhances reliability in challenging environments like urban canyons, and reduces the cost of materials. It also speeds up time-to-market and enables more compact product designs.
The Teseo VI family of receivers builds on ST’s extensive experience and integrates various proprietary technologies, including advanced positioning and embedded memory features. The new GNSS receivers include the Teseo VI STA8600A and Teseo VI+ STA8610A, each featuring dual independent Arm® Cortex®-M7 processing cores for managing all integrated circuit functions. These cores enable powerful 32-bit processing and support concurrent multi-constellation and multi-band operations on a single die.
Teseo VI+ receivers can also accommodate additional positioning engines developed by authorized third-party partners, allowing for centimeter-level accuracy through real-time kinematics. Another variant, the Teseo APP2 STA9200MA, features dual cores operating in lockstep, providing hardware redundancy for applications requiring high safety standards, such as vehicle guidance systems meeting ISO 26262 ASIL-B functional safety. Pin compatibility with other Teseo VI ICs simplifies PCB design, supporting both ASIL-certified and non-ASIL applications.
All versions feature ST’s innovative RF architecture and GNSS baseband design, offering quad-band GNSS support (L1, L2, L5, and E6) with unique capabilities to track only the L5 band. This reduces data outliers and improves robustness in environments like urban canyons or areas with jammers.
Additionally, the proprietary phase-change memory (PCM) technology eliminates the need for external memory, minimizing material costs and simplifying the supply chain. PCM technology is durable and can withstand tough conditions like automotive environments, offering non-volatile memory similar to Flash, but with smaller cell sizes for efficient on-chip integration.
The devices are equipped with a comprehensive set of security features, including secure boot, over-the-air firmware updates, and output data protection. They also integrate a hardware security module (HSM) to safeguard against cyber threats and comply with the latest cybersecurity standards, such as UNECE R155 and ISO 21434.
STMicroelectronics also supports the Teseo VI series with a network of suppliers and partners offering algorithms, reference designs, and complementary hardware. For automotive applications, two new GNSS modules, the Teseo-VIC6A and Teseo-ELE6A, integrate the Teseo VI and Teseo VI+ ICs, respectively. These modules, available in compact form factors, simplify integration and deliver optimal performance on customer platforms.
STMicroelectronics, a leader in semiconductor technologies, is committed to delivering innovative products and solutions that enable smarter mobility, energy efficiency, and the deployment of cloud-connected autonomous technologies. The company is focused on achieving carbon neutrality by 2027 across its direct and some indirect emissions.
