STMicroelectronics (NYSE: STM), a global semiconductor company, has introduced ST SafeSense VD56GA, a new 1.1-megapixel automotive image sensor designed for infrared in-cabin sensing. The sensor is aimed at helping automakers and Tier 1 suppliers expand driver and occupant monitoring systems across high-volume vehicle platforms while managing system cost and integration requirements.
As driver and occupant monitoring becomes more common across vehicle segments, manufacturers are looking for compact imaging solutions that can deliver the required performance without adding complexity or increasing camera system costs. VD56GA combines high infrared sensitivity with embedded image-processing features in a compact sensor architecture.
The sensor uses STMicroelectronics’ new ST DeepNIR backside-illuminated pixel architecture, developed for infrared imaging. Compared with the previous generation, VD56GA provides 35% higher image sharpness and nearly 60% higher infrared sensitivity. The company said the performance can support demanding applications, including camera systems installed behind displays.
Alexandre Balmefrezol, Executive Vice President and General Manager, Imaging Sub-Group, STMicroelectronics, said: “In-cabin sensing is moving into more vehicle platforms, creating demand for cost-effective solutions that can be deployed at high volumes. With VD56GA, we focused on image quality in infrared conditions, compact integration and system cost. The sensor also benefits from ST’s manufacturing model, including front-end production in Crolles, France, supporting supply-chain resilience, quality control and long-term supply for automotive programmes.”
According to Anas Chalak, Market & Technology Analyst, Imaging at Yole Group, the market for driver and occupant monitoring is expanding across vehicle platforms, with volumes expected to exceed 70 million units by 2031. He said cost reduction, simplified integration and scalability will be important factors as these systems become more widely adopted.
VD56GA is designed to help reduce the overall cost of automotive camera modules. Its imaging performance can support the use of lower-cost optics, simpler infrared illumination and less demanding optical filtering. The sensor also includes embedded image-processing capabilities, reducing the need for additional external processing components.
The sensor’s ST DeepNIR technology is designed to improve infrared imaging performance while retaining a compact 1.1-megapixel architecture. This allows camera developers to target the image quality required for driver and occupant monitoring while maintaining the size and integration benefits of a compact sensor.
VD56GA is housed in a 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained automotive camera modules and new in-cabin sensing applications. The sensor integrates several image-processing functions, including mirror, crop, dark calibration, auto exposure and piecewise-linear processing. These functions can reduce the need for external processing resources and help simplify camera development.
The device supports both RAW and YUV output formats, providing flexibility for different vehicle electronic architectures and software platforms. VD56GA expands STMicroelectronics’ automotive imaging portfolio and builds on its work in driver and occupant monitoring. Earlier in 2026, the company announced the shipment of its 10 millionth SafeSense automotive image sensor, reflecting adoption across automotive markets in Europe, Asia and the United States.
STMicroelectronics follows a vertically integrated manufacturing model for its automotive imaging products. Front-end manufacturing of VD56GA is carried out at the company’s facility in Crolles, France, while packaging is performed in Asia. The manufacturing approach is intended to support product quality, supply continuity and long-term requirements of automotive customers.
