Rohde & Schwarz verifies Bullitt smartphone’s NTN capabilities with MediaTek 3GPP Rel.17 Chipset

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The R&S CMW500 wideband radio communication tester and R&S SMBV100B GNSS simulator emulate a satellite base station for 3GPP NTN testing

Rohde & Schwarz has partnered with Bullitt and MediaTek to fully test and verify the world’s first satellite-to-mobile messaging 5G smartphone in line with 3GPP Release 17. The groundbreaking test solution from Rohde & Schwarz verifies that SOS messaging and two-way messaging work reliably in no-coverage scenarios via non-terrestrial networks (NTN) in line with 3GPP.

At MWC Barcelona, a test setup is showcased at the Rohde & Schwarz booth featuring a rugged 5G smartphone from Bullitt with integrated MediaTek 3GPP NTN Rel.17 chipset as DUT. Rohde & Schwarz has expanded its NB-IoT solution to include 3GPP Release 17 NTN features, allowing for testing and verification of the world’s first 5G satellite-to-mobile messaging smartphone.

The device is designed by Bullitt and powered by MediaTek’s 3GPP NTN Rel.17 chipset, which has enabled direct-to-satellite communication in Bullitt’s rugged 5G smartphones. Bullitt is the first company to integrate the MediaTek 3GPP NTN Rel.17 chipset in its device. The addition of the 3GPP Release 17 NTN features to Rohde & Schwarz’s NB-IoT solution has created an ecosystem for R&D, production, and conformance testing.

Non-terrestrial networks became a major topic in the wireless industry with the publication of 3GPP Release 17. The primary use case is network coverage via satellite for emergencies in remote rural or offshore areas as well as for global tracking and positioning. The market-leading R&S CMW500 wideband radio communication tester from Rohde & Schwarz now supports Rel-17 NB-NTN and simulates a satellite base station by using an R&S SMBV100B to generate GNSS signals.

Rohde & Schwarz is presenting advanced testing and verification solutions for 3GPP NTN at the Mobile World Congress 2023, featuring the world’s first 5G satellite-to-mobile messaging smartphone designed by Bullitt and powered by MediaTek’s 3GPP NTN Rel.17 chipset. Attendees at the trade show can visit Rohde & Schwarz’s booth (5A80) in hall 5 of Fira Gran Via in Barcelona to learn about the company’s innovative solutions that address testing and verification requirements for NTN and other cutting-edge technologies.