NIPPON KINZOKU Introduces “STA Finish” Stainless Steel for High-Precision Etching

Manufacturing-news
Image Courtesy: NIPPON KINZOKU

NIPPON KINZOKU CO, LTD (Headquarters: Minato-ku, Tokyo) has unveiled its latest addition to the Eco-Product series—the STA (Special Tension Annealing) finish stainless steel. This new material addresses long-standing challenges in the etching process, particularly spring material warping during half-etching, by eliminating distortion and enhancing dimensional stability.

The STA finish also delivers refined crystal grain structures, producing smoother etched surfaces suited for advanced microfabrication. These improvements simplify manufacturing steps, enhance processing efficiency, and reduce environmental impact. The material supports flexible design requirements, enabling better yield and optimized product performance.

Adopted in components such as smartphone parts, metal masks, and wrapping carriers, the STA finish is officially recognized as an Eco-Product. It aligns with NIPPON KINZOKU’s commitment to carbon neutrality by 2050 and supports the company’s long-term management vision, NIPPON KINZOKU 2030. Target markets include 5G communications, mobile devices, and semiconductor applications, where high-performance materials are in demand.

The product combines heat treatment and shape correction in a single process, delivering exceptional flatness and minimizing internal stress, which makes it ideal for applications demanding high precision. An optional fine-grained variant is also offered, specifically designed to deliver smoother etching results and improved surface quality.

Available in SUS304, SUS301, and SUS430 steel grades, the product is manufactured in thicknesses ranging from 0.1 mm to 0.5 mm and widths of up to 600 mm. The fine-grained option is exclusively available for SUS304, providing added versatility for specialized processing needs. NIPPON KINZOKU supplies materials across multiple industries, ranging from precision engineering to large-scale construction, supporting innovations in both advanced technology and infrastructure.