NexGen Wafer Systems has introduced the SERENO platform, a cutting-edge solution for Wet Etch and Clean applications designed to deliver high throughput and versatility. The multi-chamber system integrates advanced metrology for precise control of substrate thickness and surface roughness, while its onboard chemical supply system supports multiple process chemicals, blending, and analytics. This ensures exceptional flexibility across a range of applications.
With a compact footprint of less than 12 m² and the capability to process up to 200 wafers per hour, SERENO is engineered to offer maximum efficiency and adaptability. Its design caters to both Front-End of Line (FEOL) and Back-End of Line (BEOL) semiconductor processes, addressing the growing need for performance, precision, and cost-efficiency in the industry.
Compact Design with High Flexibility and Performance
The SERENO platform provides significant flexibility in wafer handling and process control. It accommodates 6″, 8″, and 12″ wafers, supporting wafer thicknesses from ultra-thin substrates below 100µm to bonded wafers greater than 2mm thick. The system’s high-performance chambers, coupled with advanced chemical dispensing and scanning control, ensure superior on-wafer results.
Christian Kleindienst, Chief Marketing Officer at NexGen Wafer Systems, stated, “SERENO combines high throughput in a compact form factor, offering flexible and high-performance single-wafer technology that provides a more cost-effective alternative to traditional batch systems.”
Key Features of SERENO:
- Throughput: Up to 200 wafers per hour
- Footprint: ~12 m²
- Advanced Process Control: Customizable wafer scanning and fluid dispensing for optimal performance
- Integrated Metrology: Real-time thickness and roughness monitoring for process consistency
- High-Performance Chambers: Ensures reliable, cross-contamination-free processing
- Versatile Chemical Supply: Supports up to three chemicals with dual 90-litre tanks
- Flexible Wafer Handling: Accommodates 6″, 8″, and 12″ wafers, including ultra-thin and fragile substrates
Applications for SERENO:
- Surface Cleaning: Particle removal, polymer removal, residual removal, backside/bevel cleaning, incoming wafer cleaning
- Film and Metal Etching: Backside/bevel etch (Silicon Nitride, Silicon Dioxide, Polysilicon), Metal Etch (Ti, Ni, Ag, Au, Al, W, Cu), UBM (Ag, Ni, Ti)
- Substrate Etching: Thinning, stress relief, surface conditioning, vias reveal
- Supported Substrate Types: Si, SiC, GaN, GaAs, Al2O3, ZnO
Availability
The SERENO platform is now open for orders, with initial deliveries scheduled for Q1 2025. To learn more or request a demonstration. Based in Singapore, NexGen Wafer Systems is a global leader in wet etch and clean solutions for the semiconductor industry.
With engineering and manufacturing facilities in Austria and an international team of over 100 professionals, NexGen serves customers in major semiconductor manufacturing regions worldwide. Through its research and demonstration lab in Singapore, NexGen collaborates with clients to develop wet etch and clean process solutions in fast-paced R&D environments. With over 200 process chambers installed globally, NexGen is on track to become a leading provider of specialized surface treatment applications.
