MosChip Technologies has successfully completed the silicon bring-up of a custom system-on-chip (SoC) developed for the Space Applications Centre (SAC) of the Indian Space Research Organisation (ISRO), marking the completion of a full turnkey ASIC engagement from netlist to packaged silicon. Fabricated on a 28nm technology node, the program covered the entire ASIC lifecycle.
Following tape-out using MosChip’s established netlist-to-GDSII methodology, the company executed substrate design for a 10-layer FC-CBGA package, assembly, and engineering sample validation on automated test equipment. The silicon has met all functional specifications, clearing the path for the next phase of production.
SAC is one of ISRO’s premier research and development centres, with deep expertise across satellite systems for earth observation, communication, navigation, and scientific missions. The organisation continues to play a pivotal role in advancing space technologies for both national and global applications.
The project highlights MosChip’s end-to-end turnkey ASIC capabilities. The company managed all critical stages of execution, including DFT architecture, implementation and verification, full-chip physical design and sign-off, redistribution layer design, package engineering, tester board development, and post-silicon validation. This integrated approach reduced handoff risks, shortened development timelines, and ensured consistent execution across design, packaging, and test. Packaged and validated silicon has now been delivered to SAC, enabling the organisation to move forward with production planning.
Commenting on the milestone, Srinivasa Rao Kakumanu, CEO & Managing Director of MosChip Technologies, said the program reinforces the company’s ability to deliver single-point accountability from design intent through validated silicon. He added that MosChip’s unified execution model helps customers transition from specification and RTL to working silicon with predictable schedules and strong first-pass success.
MosChip Technologies is a long-standing partner to global enterprises and technology innovators, offering silicon and product engineering services backed by more than 25 years of experience. Its capabilities span chip design, hardware engineering, embedded software, cloud computing, and AI-led solutions, enabling customers to build next-generation intelligent products across industries.
