Kaynes Semicon to Invest Rs 4,000 Crore in Semiconductor Manufacturing


Kaynes Semicon, a subsidiary under Kaynes Technology, is planning a Rs 4,000 crore investment to establish a semiconductor OSAT/ATMP (assembly, testing, marking, and packaging) plant. The company is currently considering multiple locations for the plant, with Hyderabad, Ahmedabad, and Bhubaneswar being its top choices.

Kaynes Semiconductors, founded in 1988, is a leading electronic manufacturing services (EMS) company based in Bengaluru, India. With over three decades of experience, it has established itself as a trusted partner for a wide range of industries, including automotive, industrial, consumer electronics, and more. The company specializes in PCB assembly, box build assembly, and testing services, offering end-to-end solutions to meet the diverse needs of its customers.

Kaynes Semicon’s state-of-the-art facilities, stringent quality standards, and commitment to innovation have earned it a reputation for excellence in the EMS industry. As a customer-centric organization, Kaynes Semicon strives to deliver high-quality, cost-effective solutions that exceed customer expectations.

According to CEO Raghu Panicker, this substantial investment is expected to create over 1,000 job opportunities. Final approval from the government is anticipated in the upcoming months, which will play a pivotal role in bolstering India’s position in the semiconductor manufacturing sector.

Kaynes Technologies, the parent company, intends to allocate approximately Rs 200 crore towards research and development for the OSAT project, alongside its semiconductor venture. This strategic move aligns with India’s broader goal of establishing itself as a global hub for electronics manufacturing, particularly in semiconductors.

The government has demonstrated its commitment to fostering the growth of the semiconductor and display manufacturing sector in the country, evident from the Rs 2,30,000 crore budget earmarked for this purpose in December 2021. India has long been recognized for its expertise in chip design, comprising 20% of the world’s skill in this area.

Kaynes Technology is enhancing the backend of semiconductor manufacturing through a dispersed manufacturing infrastructure spanning several cities. One of the company’s expansion objectives is to establish a bare board printed circuit board facility equipped with HDI (High-density Interconnect) technology.

Moreover, Kaynes Technology is collaborating with technology partners from Europe and Japan to actively explore investment opportunities in silicon carbide fab, silicon fab, and display fab. The government’s substantial financial commitment to developing the semiconductor ecosystem is supporting these initiatives, marking a significant shift for India from chip design to chip manufacturing.


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