KAGA FEI Co, Ltd, a supplier of short-range wireless communication modules, has announced the launch of two new Bluetooth Low Energy (LE) modules: the EC4L10BA1 and EC4L05BA1. These additions extend the company’s Bluetooth 6 lineup, joining the previously released EC4L15BA1. All modules are equipped with built-in antennas and support Bluetooth 6 functionality.
The new modules are built around a chip that meets PSA Level 3 certification standards, offering advanced security features for IoT applications. Mass production is scheduled to begin in January 2026. The expanded lineup addresses growing demand for flexible and secure wireless solutions in connected devices.
The latest module lineup offers a flexible range of memory configurations designed to suit diverse application needs. It features three distinct variants: the EC4L15BA1 with 1.5MB NVM and 256KB RAM, the EC4L10BA1 with 1.0MB NVM and 192KB RAM, and the EC4L05BA1 equipped with 0.5MB NVM and 96KB RAM. These options allow developers to select a model that best fits their performance and budget requirements—whether targeting high-end industrial and medical applications or cost-conscious consumer devices.
Security is a top priority for modern connected devices, and these modules are built on a chip certified to PSA Level 3, the highest benchmark for Internet of Things (IoT) security. This certification ensures robust protection against both software and hardware attacks, offering developers the assurance needed to build trustworthy, secure IoT solutions that meet today’s stringent cybersecurity demands.
The modules are engineered for broad protocol compatibility, supporting Bluetooth Low Energy, Thread, and the emerging Matter protocol—making them ideal for integration into smart home, industrial, and IoT ecosystems. Additionally, a proprietary 4Mbps communication mode is available, enabling high-speed data transfer and expanded design flexibility across various wireless applications.
Each module comes with an integrated antenna, streamlining hardware integration and design. Moreover, the products are pre-certified by regulatory agencies in Japan (MIC), the United States (FCC), and Canada (ISED). These approvals significantly reduce the time and cost typically associated with wireless device development and market entry.
A standout feature of the modules is their support for the latest Bluetooth SIG standards, including Channel Sounding, a technology that allows for highly accurate distance and location measurements. This functionality opens new opportunities for advanced indoor positioning and proximity-based services.
By combining strong security features, multi-protocol support, flexible memory options, and global certifications, this module series offers developers a powerful platform to bring next-generation connected products to market faster and more efficiently. Whether you’re working on consumer gadgets, smart infrastructure, or complex industrial systems, these modules provide a dependable and versatile foundation tailored to modern connectivity and performance needs.
