izmomicro, a specialized division of izmo Ltd, has achieved a major milestone in silicon photonics packaging, marking India’s entry into the league of global leaders in advanced semiconductor integration. The company has developed a high-density silicon photonics packaging platform that supports 32-channel fiber input/output with an industry-leading insertion loss of less than 2 dB. Reaching this level of density requires nanometer-level optical alignment, advanced assembly techniques, and seamless electronics integration—long considered one of the most complex challenges in the field.
In addition, the module incorporates 32 DC I/Os, 4 RF I/Os, and high-speed RF performance up to 70 GHz, setting a new benchmark in combining photonic and electronic systems. This innovation addresses a critical bottleneck in silicon photonics and places izmomicro among a select few global players capable of delivering such solutions.
With copper interconnects nearing their physical limits, silicon photonics has become the foundation for multi-terabit optical communication—crucial for hyperscale data centers, AI clusters, cloud platforms, and next-generation 5G/6G networks. By overcoming packaging constraints, izmomicro is enabling the scalability, efficiency, and energy savings demanded by tomorrow’s digital infrastructure.
“Achieving this level of fiber density with ultra-low insertion loss is a defining moment for us,” said Dinanath Soni, Executive Director, izmomicro. “Only a handful of companies worldwide have demonstrated this capability, and we are proud to be the first in India. This validates our years of focused R&D and positions us as a trusted partner for the global silicon photonics industry. Our innovation will help power the infrastructure of AI, telecommunications, and high-performance computing.”
The global silicon photonics market, estimated at USD 2.65 billion in 2025, is projected to surpass USD 9 billion by 2030, growing at a CAGR of over 25%. The demand for faster, more efficient data transmission across AI workloads, telecommunications, and cloud platforms will be the primary driver of this growth. With its breakthrough in packaging density, izmomicro is strategically positioned to play a vital role in this transformation.
izmomicro, a division of publicly listed izmo Ltd, is India’s first dedicated silicon photonics packaging and semiconductor system integration specialist. Based in Bengaluru, the company operates a Class 1000 Cleanroom facility and provides design, packaging, and assembly solutions for high-performance computing, AI infrastructure, telecommunications, aerospace, and renewable energy. By combining deep technical expertise with global collaborations, izmomicro advances next-generation semiconductor technologies while supporting India’s Make in India vision.
