Esmo Group, a renowned full-service systems integrator known for providing advanced engineering services, is proud to unveil its latest breakthrough innovation, lykos. lykos is a state-of-the-art modular Burn-in Board (BIB) loading and unloading system designed to address the challenges faced by the semiconductor industry, particularly in managing volume and turnaround time during the burn-in process. By eliminating manual placement and orientation errors, lykos aims to enhance efficiency, reduce defects, and accelerate production cycles.
The semiconductor industry has been experiencing soaring demand for microchips, necessitating efficient methods to manage production. Burn-in is a critical process used to identify early failures in semiconductor devices. However, traditional manual burn-in methods involving hand placement, flipping, and stacking are time-consuming, error-prone, and can potentially damage delicate wafers. These inefficiencies lead to costly downtime and product defects.
lykos by Esmo Group provides a reliable and portable device handling system, offering modular machine configuration and customizable options to meet specific requirements and applications. With ergonomic control panels and user-friendly software, lykos eliminates the need for manual placement and orientation, ensuring reliable and accurate operations. The system’s advanced automation capabilities significantly enhance operational efficiency, reduce manufacturing defects, and expedite production cycles.
lykos features fully automated open-top sockets (OTS) loading, streamlining the process and eliminating manual errors. Its versatile BIB clamping mechanisms accommodate a wide range of semiconductor devices, ensuring flexibility. The system guarantees precise device orientation, crucial for proper functionality during burn-in, while also handling small devices as small as 1x1mm, offering versatility for different microchip sizes. With a high-precision 4+1-axis portal pick-and-place robot system, lykos ensures accurate device positioning with ±0.05mm accuracy. It incorporates an integrated camera system for efficient and accurate operations, supporting various interface options for seamless integration into existing production lines. lykos boasts reliability with high Mean Time Between Failures (MTBF) values, minimizing maintenance efforts and ensuring consistent performance. Additionally, optional enhancements such as a positioning vision system, ionizer, vacuum generator, and signal light tower systems are available, enhancing functionality and customization.
With the introduction of lykos, Esmo Group brings a game-changing solution to the semiconductor industry. By eliminating manual errors, increasing operational efficiency, and reducing defects, lykos sets a new standard for BIB loading and unloading systems. Its modular design, versatile features, and reliable performance make it an essential tool in semiconductor manufacturing, ensuring faster production cycles and enhanced product quality. Esmo Group’s commitment to innovation and advanced engineering services continues to drive progress in the industry, meeting the evolving needs.
