Infineon Technologies, one of the leading players in the semiconductor industry, has introduced the 4.5 kV XHP™ 3 IGBT modules to address the demand for downsizing and integration in various applications. This innovation is set to enhance medium voltage drives (MVD) and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies. The applications benefiting from this breakthrough include large conveyor belts, pumps, high-speed trains, locomotives, as well as commercial, construction, and agricultural vehicles (CAV).
Infineon Technologies stands as one of the leaders in power semiconductors, driving innovation in power systems. Acclaimed for its innovative silicon, silicon-carbide, and gallium-nitride-based power solutions, along with advanced drivers, microcontrollers, and software, Infineon plays a pivotal role in advancing energy efficiency and green power initiatives. Infineon’s comprehensive portfolio, spanning sensors, microcontrollers, communication devices, and security technologies, combined with sophisticated software, plays a crucial role in bringing both industrial and consumer IoT applications to life.
The XHP family includes a 450 A dual IGBT module with TRENCHSTOP™ IGBT4 and an emitter-controlled diode, along with a 450 A double diode module featuring emitter-controlled E4 Diode. These modules come with an enhanced isolation capability of 10.4 kV. Together, they facilitate simplified paralleling and downsizing without compromising efficiency. In contrast to previous complex busbar requirements for paralleling switching modules, the innovative design of the XHP family streamlines the process by conveniently placing connections side by side. Consequently, only a single straight busbar is necessary for paralleling.
One of the advantages of the 4.5 kV XHP family is its ability to enable developers to reduce the number of units required. Traditional IGBT solutions typically involve multiple single switches and a double diode. However, the new XHP devices allow designs to be reduced to two dual switches and a smaller double diode, representing a significant leap in integrated drives.
The combination of the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 double diode not only results in significant cost savings but also a smaller footprint. For example, Infineon’s previous IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and one 140 x 130 mm² double diode. With the introduction of the XHP family, these components can be streamlined to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² double diode.
The availability of the IGBT modules FF450R45T3E4_B5 and DD450S45T3E4_B5 is immediate, contributing extensively in mitigating the market demands for more compact and efficient solutions. This development aligns with Infineon’s mission to drive innovation in power systems and the Internet of Things (IoT). The company, with around 58,600 employees globally, is positioned as a semiconductor leader, contributing to decarbonization and digitalization with its cutting-edge products and solutions. In the fiscal year 2023, ending on September 30, Infineon generated revenue of about €16.3 billion, firmly establishing itself as one of the key players in the semiconductor industry.
