Hitachi High-Tech Corp. Introduces DI2800: A Breakthrough in Semiconductor Wafer Defect Inspection

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Hitachi Dark Field Wafer Defect Inspection System DI4600 (Image Courtesy: Hitachi)

Hitachi High-Tech Corp. achieves a groundbreaking stride in semiconductor manufacturing with the unveiling of the Hitachi Dark Field Wafer Defect Inspection System DI2800.This cutting-edge metrology system is a crucial element for semiconductor manufacturers, offering high-speed capabilities to identify defects and particles on patterned wafers up to 8 inches (200mm).

The DI2800, with its exceptional throughput and performance, plays a pivotal role in ensuring device reliability and safety, especially for highly sensitive applications like the Internet of Things (IoT) and automotive fields, where 100% inspection is imperative.

The demand for semiconductor devices has surged in recent years, driven by the rise of next-generation communication networks (5G) and the accelerated adoption of electric vehicles. This trend is particularly evident in the IoT and automotive sectors, where reliability and safety are paramount considerations. While conventional semiconductor manufacturing involves spot-check inspections for process management and yield improvement, the stringent requirements of the IoT and automotive fields necessitate 100% inspection during manufacturing to identify defective products, ensuring high reliability and safety.

Addressing these market needs, Hitachi High-Tech’s Dark Field Wafer Defect Inspection System DI2800 incorporates advanced scattering-intensity simulation technology to optimize illumination and detection optics. This enables highly sensitive inspection of patterned-wafer defects that may develop during the manufacturing process. The system boasts a remarkable detection sensitivity of 0.1-micron standard particle size on mirrored wafers. This exceptional performance extends even to devices as small as 0.3-mm square, overcoming previous challenges associated with sensitivity and data processing limitations.

One of the standout features of the DI2800 is its highly optimized inspection sequence, allowing throughputs of over 40 200-mm wafers per hour. This remarkable speed is a game-changer for semiconductor manufacturers dealing with the high-volume production demands of the IoT and automotive sectors.

Hitachi High-Tech plans to provide the DI2800 in combination with the Advanced CD Measurement SEM CS4800 and 3D SEM CT1000, two existing products in their portfolio. These offerings collectively address the diverse metrology needs arising from the mass production of semiconductor devices in the IoT and automotive fields. Looking ahead, Hitachi is committed to continuous product improvement, leveraging data collected from all three product lines. This data-driven approach aims to deliver new, value-added solutions, contributing to the enhanced reliability and safety of semiconductor devices in critical sectors.

The Hitachi Dark Field Wafer Defect Inspection System DI2800 marks a significant advancement in semiconductor manufacturing, offering a comprehensive solution to meet the evolving challenges of the industry. With its innovative technology and commitment to ongoing improvement, Hitachi High-Tech is poised to play a key role in shaping the future of semiconductor inspection and reliability.