Entity 1 Value Emissions Pvt Ltd, India, and HIT, Taiwan, today unveiled a pioneering proof of concept (PoC) initiative: silicon carbide (SiC) wafers produced from silicon derived from red mud, with testing conducted by semiconductor experts at HIT, Taiwan. This achievement underscores India’s rising role as an innovator in sustainable materials for the semiconductor industry and aligns with the “Make in India” initiative, fostering growth in domestic manufacturing.
The project focuses on producing silicon carbide (SiC) wafers using silicon extracted from red mud, a byproduct of alumina production. The wafers are currently available in testing-grade formats, with three sizes—7×7 mm, 10×10 mm, and 13×13 mm—undergoing Proof-of-Concept (PoC) evaluation.
The source material for these wafers is red mud provided by National Aluminium Company Limited (NALCO) from its operations in Damanjodi, Odisha. The silicon carbide material was successfully derived from NALCO’s red mud silica feedstock, demonstrating a novel method of turning industrial waste into a valuable semiconductor material.
Testing is being conducted in collaboration with HIT, Taiwan, and semiconductor industry experts to validate the process viability and performance of the SiC wafers. This joint effort ensures rigorous testing standards, helping accelerate the readiness of the wafers for commercial adoption.
This project highlights India’s growing leadership in valorizing industrial byproducts and building robust domestic supply chains for critical semiconductor materials. The initiative has drawn interest from the Prime Minister’s Office, signaling its strategic importance at a national level.
By localizing the source of silicon carbide material, India takes a significant step toward reducing import dependency, improving energy efficiency, and promoting waste utilization. This positions India as a global hub for sustainable materials, opening opportunities for technology transfer, licensing, and supporting the growth of SMEs and national champions.
HIT’s involvement as a testing and qualification partner ensures that the wafers meet international standards for high-performance applications. This cross-border collaboration between India and Taiwan represents a model for resilient and risk-managed supply chains for advanced semiconductor packaging and power electronics applications.
The partnership underscores a joint commitment to sustainable metallurgy and semiconductor innovation, aligning with ESG objectives. It strengthens regional supply chains and fosters greater cooperation across Asia’s semiconductor ecosystem, benefiting both nations.
The initiative ensures NALCO’s approval as a feedstock source, creating a secure domestic pipeline for critical materials. It boosts India’s “Make in India” ambitions by strengthening capabilities in SiC wafer production, crucial for power electronics and high-temperature applications. At the same time, it demonstrates red mud valorization, converting waste into a scalable resource and advancing a circular economy.
The program offers resilient supply chains, reducing reliance on imports and improving lead times for semiconductor packaging. It supports ESG goals by cutting waste and emissions, while enabling innovation in process development and device design—paving the way for advanced SiC applications in global markets.
The roadmap includes expanded PoC testing across wafer sizes with enhanced performance metrics, followed by qualification programs with select semiconductor fabs. Plans are underway to work with NALCO on supply scaling to ensure a reliable flow of red mud-derived silica, while exploring licensing opportunities and potential on-site reactor installations to support future expansion. This collaboration sets the stage for India and Taiwan to become leaders in sustainable semiconductor materials, transforming the industry while promoting a greener, more efficient future.
