ITEN, a specialist in micro solid-state batteries, and Singapore’s A*STAR Institute of Microelectronics (IME), known for its cutting-edge work in semiconductor packaging, have announced a major advancement in integrating battery technology into chip-level packaging. By embedding ITEN’s solid-state micro batteries directly at the wafer level using ASTAR IME’s advanced packaging techniques, this collaboration has achieved a new level of compact energy storage within system-in-package (SiP) designs.
This development allows electronic systems to operate with greater efficiency and less reliance on external power components. It opens the door for more compact, power-efficient electronics by embedding energy storage directly into the chip package, eliminating the need for separate battery modules. The result is smaller devices, faster energy delivery, and improved performance across a range of applications.
The benefits of this integration are clear. With batteries placed inside the chip package, energy transfer is streamlined, reducing power loss. Devices can be made smaller and more efficient—ideal for applications in wearables, IoT sensors, and compact medical equipment. Fewer interconnects and connectors also mean a lower risk of component failure, resulting in higher reliability and longer device life.
From a sustainability perspective, the innovation is equally important. ITEN’s solid-state batteries contain no hazardous materials and are designed to reduce waste over time by extending device lifespan and reducing the need for external power components. This contributes to a more sustainable electronics industry with lower environmental impact.
The collaboration is expected to have wide-reaching implications for the future of electronics. By integrating energy storage within chip packages, it becomes possible to build highly compact, multifunctional devices suited to the growing demands of sectors like healthcare, consumer electronics, and connected infrastructure.
Leaders from both organizations emphasized the significance of the achievement. Terence Gan, Executive Director at A*STAR IME, remarked that this development enables new uses of SiP technology and creates opportunities in emerging tech markets. Vincent Cobee, CEO of ITEN, highlighted the value of A*STAR IME’s packaging expertise in bringing their battery technology to new levels of integration and commercial readiness.
This announcement is also a key step in pushing the boundaries of 3D integration and chiplet architectures. The new approach can support the next wave of chip designs where processing, sensing, and energy are all tightly packed together for maximum efficiency and minimal space usage.
A*STAR IME’s packaging work includes a wide array of platforms such as fan-out wafer-level packaging, interposer-based designs, and hybrid bonding technologies. These platforms support the development of increasingly complex and power-efficient electronics through tight integration and optimized thermal, electrical, and mechanical performance.
ITEN, based in France, is recognized for its innovation in solid-state battery development. The company has secured more than 200 patents and serves demanding sectors where performance and size are critical. It has earned several industry honors, including the CES 2024 Best of Innovation Award and recognition under the French Tech 120 program.
A*STAR, Singapore’s lead research agency, continues to bridge the gap between scientific research and industry needs. Its research centers at Biopolis and Fusionopolis drive innovations across biomedical, engineering, and physical sciences, helping to grow the economy and improve lives through science and technology.
